Lead frame Hillock-Induced Silicon Crack

2006 ◽  
Author(s):  
R.C. Flores ◽  
M.G. Fabia ◽  
M.T. Nabong ◽  
A.O. Soria ◽  
C.B. Gabunas
Keyword(s):  
Lead Frame

Backside Mechanical Preparation Methodology for Effective Failure Analysis on Small and Non-Exposed Die Paddle Package

2018 ◽  
Author(s):  
Ong Pei Hoon ◽  
Ng Kiong Kay ◽  
Gwee Hoon Yen
Keyword(s):  
Failure Analysis ◽  
Chemical Etching ◽  
Chemical Resistance ◽  
Etching Time ◽  
Lead Frame ◽  
Front Side ◽  
Electrical Measurements ◽  
Mechanical Preparation ◽  
Die Surface ◽  
Copper Lead

Abstract Chemical etching is commonly used in exposing the die surface from die front-side and die backside because of its quick etching time, burr-free and stress-free. However, this technique is risky when performing copper lead frame etching during backside preparation on small and non-exposed die paddle package. The drawback of this technique is that the copper leads will be over etched by 65% Acid Nitric Fuming even though the device’s leads are protected by chemical resistance tape. Consequently, the device is not able to proceed to any other further electrical measurements. Therefore, we introduced mechanical preparation as an alternative solution to replace the existing procedure. With the new method, we are able to ensure the copper leads are intact for the electrical measurements to improve the effectiveness and accuracy of physical failure analysis.

Preventing whiskers in electrodeposited tin for semiconductor lead frame applications

Circuit World ◽  
2004 ◽  
Vol 30 (2) ◽  
pp. 20-24 ◽  
Author(s):  
Keith Whitlaw ◽  
André Egli ◽  
Mike Toben
Keyword(s):  
Lead Frame

Oxidation characteristics of commercial copper-based lead frame surface and the bonding with epoxy molding compounds

2019 ◽  
Vol 99 ◽  
pp. 161-167 ◽  
Author(s):  
Shih-Chieh Chao ◽  
Wei-Chen Huang ◽  
Jen-Hsiang Liu ◽  
Jenn-Ming Song ◽  
Po-Yen Shen ◽  
...  
Keyword(s):  
Lead Frame ◽  
Molding Compounds ◽  
Oxidation Characteristics ◽  
Commercial Copper

scholarly journals Shape Evolution of Lead Frame by Electrolytic Etching.

2000 ◽  
Vol 26 (2) ◽  
pp. 280-285
Author(s):  
KAZUO KONDO ◽  
MIHOKO UEMURA ◽  
TAKAKO OKUNO ◽  
ZENNOSUKE TANAKA
Keyword(s):  
Shape Evolution ◽  
Lead Frame ◽  
Electrolytic Etching

Board-Level Reliability of Pb-Free Surface Mounted Assemblies during Thermal Shock Testing

2006 ◽  
Vol 15-17 ◽  
pp. 633-638 ◽  
Author(s):  
Jong Woong Kim ◽  
Hyun Suk Chun ◽  
Sang Su Ha ◽  
Jong Hyuck Chae ◽  
Jin Ho Joo ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Lead Frame ◽  
Shear Forces ◽  
Microstructural Investigation ◽  
Shock Testing ◽  
Ceramic Capacitor ◽  
Board Level ◽  
Board Level Reliability ◽  
Thermal Shocks

Board-level reliability of conventional Sn-37Pb and Pb-free Sn-3.0Ag-0.5Cu solder joints was evaluated using thermal shock testing. In the microstructural investigation of the solder joints, the formation of Cu6Sn5 intermetallic compound (IMC) layer was observed between both solders and Cu lead frame, but any crack or newly introduced defect cannot be found even after 2000 cycles of thermal shocks. Shear test of the multi layer ceramic capacitor (MLCC) joints were also conducted to investigate the effect of microstructural variations on the bonding strength of the solder joints. Shear forces of the both solder joints decreased with increasing thermal shock cycles. The reason to the decrease in shear force was discussed with fracture surfaces of the shear tested solder joints.

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