Transmission electron microscopy of high threshold voltage, high contact resistance, and high sheet resistance of MOS device

2002 ◽  
Author(s):  
Tan Tsu Sheng ◽  
Chih Hang Tung ◽  
J.L.F. Wang
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Contact Resistance ◽  
Sheet Resistance ◽  
Threshold Voltage ◽  
High Threshold ◽  
Transmission Electron ◽  
Mos Device

Correlation of contact resistance with microstructure for Au/Ni/Al/Ti/AlGaN/GaN ohmic contacts using transmission electron microscopy

2001 ◽  
Vol 89 (6) ◽  
pp. 3143-3150 ◽  
Author(s):  
A. N. Bright ◽  
P. J. Thomas ◽  
M. Weyland ◽  
D. M. Tricker ◽  
C. J. Humphreys ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Contact Resistance ◽  
Ohmic Contacts ◽  
Transmission Electron

Microstructural Changes in W-Polycide Gates Capped with A Thin Polysilicon Layer

1998 ◽  
Vol 523 ◽  
Author(s):  
Y. O. Kima ◽  
J. Bevk ◽  
M. Furtsch ◽  
G. E. Georgiou ◽  
W. Mansfield ◽  
...  
Keyword(s):  
Crystal Structure ◽  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Grain Size ◽  
Dislocation Density ◽  
Sheet Resistance ◽  
Substantial Reduction ◽  
Depth Profiling ◽  
Transmission Electron ◽  
Polysilicon Layer

AbstractWe find that sheet resistance of tungsten polycide can be reduced up to 40% by depositing thin polysilicon layers on the top of the films. Transmission electron microscopy shows no significant differences in the crystal structure, grain size, or dislocation density inside the films by adding a polysilicon cap, but it clearly shows roughening of the top interface. Auger depth profiling shows substantial reduction of the Si/W ratio in the capped films. Both results imply that the excess Si segregates to both polysilicon interfaces, effectively lowering the Si/W ratio and resulting in a low sheet resistance.

High resolution analyzes of resistance behavior in eWLB metal contacts

2011 ◽  
Vol 2011 (1) ◽  
pp. 000241-000248
Author(s):  
S. Klengel (Bennemann) ◽  
M. Krause ◽  
L. Berthold ◽  
M. Petzold ◽  
J. Förster ◽  
...  
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
High Resolution ◽  
Contact Resistance ◽  
Electrical Performance ◽  
Wafer Level ◽  
Tof Sims ◽  
Intermediate Layers ◽  
Transmission Electron

The embedded Wafer Level Ball Grid Array (eWLB) technology is a new packaging solution that allows a minimum package size for any number of interconnects at a given pitch and the possibility of further system integration in x-, y- and z-direction. The eWLB is a fan-out wafer level package solution realized by a thin film redistribution layer above the semiconductor chip and using standard thin-film processes. The eWLB technology is driven by smaller form factor and better electrical performance with respect to high frequency applications. For optimum electrical performance, it is important to measure and control the contact resistance at interfaces caused by intermediate layers of the electrical re-routing. This paper presents a case study for high resolution analyzes at the eWLB metallization system Al/TiW/Cu with different intermetallic resistance behavior. First, we investigate different eWLB metallization systems after different process step variations. We observe chemically high resistance intermediate layers using Time-of-Flight Mass Spectrometry (ToF-SIMS). These results show that the intermediate layer consists of carbon, oxygen, fluorine, chlorine and sulfur. Second, we applied Focused Ion Beam (FIB) preparation and Transmission Electron Microscopy (TEM) as well as High Resolution Transmission Electron Microscopy (HRTEM) experiments to investigate the metallization interface Al/TiW/Cu. We resolve a porous 2–10 nm thin layer. We show that control of different humidity concentration out of the mold compound and different pre-clean etch rates at warped wafer parts are crucial for optimum contact resistance. The results demonstrate that high resolution analyzes and combinations of different analytical methods (e.g. HRTEM and ToF-SIMS) are very important for optimum process developments in modern package technology.

Techniques for Transmission Electron Microscopy of Fiber-Matrix Interfaces in Aluminum Alloy-Boron Composites by Ion Erosio

1971 ◽  
Vol 29 ◽  
pp. 204-205
Author(s):  
G. G. Shaw
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Aluminum Alloy ◽  
Electron Beam ◽  
Pure Aluminum ◽  
Ion Milling ◽  
Transmission Electron ◽  
Fiber Matrix ◽  
Ion Erosion ◽  
Row Of Fibers

The morphology and composition of the fiber-matrix interface can best be studied by transmission electron microscopy and electron diffraction. For some composites satisfactory samples can be prepared by electropolishing. For others such as aluminum alloy-boron composites ion erosion is necessary.When one wishes to examine a specimen with the electron beam perpendicular to the fiber, preparation is as follows: A 1/8 in. disk is cut from the sample with a cylindrical tool by spark machining. Thin slices, 5 mils thick, containing one row of fibers, are then, spark-machined from the disk. After spark machining, the slice is carefully polished with diamond paste until the row of fibers is exposed on each side, as shown in Figure 1.In the case where examination is desired with the electron beam parallel to the fiber, preparation is as follows: Experimental composites are usually 50 mils or less in thickness so an auxiliary holder is necessary during ion milling and for easy transfer to the electron microscope. This holder is pure aluminum sheet, 3 mils thick.

Direct Observation of Heat Exchanger Deposits by Cross Sectioning

1967 ◽  
Vol 25 ◽  
pp. 364-365
Author(s):  
R. W. Anderson ◽  
D. L. Senecal
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Heat Exchanger ◽  
Direct Observation ◽  
Cross Sections ◽  
Preparation Method ◽  
Specimen Preparation ◽  
Flowing Water ◽  
Transmission Electron ◽  
Deposit Layer

A problem was presented to observe the packing densities of deposits of sub-micron corrosion product particles. The deposits were 5-100 mils thick and had formed on the inside surfaces of 3/8 inch diameter Zircaloy-2 heat exchanger tubes. The particles were iron oxides deposited from flowing water and consequently were only weakly bonded. Particular care was required during handling to preserve the original formations of the deposits. The specimen preparation method described below allowed direct observation of cross sections of the deposit layers by transmission electron microscopy.The specimens were short sections of the tubes (about 3 inches long) that were carefully cut from the systems. The insides of the tube sections were first coated with a thin layer of a fluid epoxy resin by dipping. This coating served to impregnate the deposit layer as well as to protect the layer if subsequent handling were required.

Phase Transformations in Ti-7w/oMo-3w/oMe Alloy

1974 ◽  
Vol 32 ◽  
pp. 514-515
Author(s):  
S. Fujishiro
Keyword(s):  
Electron Microscopy ◽  
Mechanical Properties ◽  
Transmission Electron Microscopy ◽  
Tensile Strength ◽  
Mechanical Processing ◽  
Ray Method ◽  
X Ray ◽  
Transmission Electron ◽  
Water Quench ◽  
Alpha Beta

The mechanical properties of three titanium alloys (Ti-7Mo-3Al, Ti-7Mo- 3Cu and Ti-7Mo-3Ta) were evaluated as function of: 1) Solutionizing in the beta field and aging, 2) Thermal Mechanical Processing in the beta field and aging, 3) Solutionizing in the alpha + beta field and aging. The samples were isothermally aged in the temperature range 300° to 700*C for 4 to 24 hours, followed by a water quench. Transmission electron microscopy and X-ray method were used to identify the phase formed. All three alloys solutionized at 1050°C (beta field) transformed to martensitic alpha (alpha prime) upon being water quenched. Despite this heavily strained alpha prime, which is characterized by microtwins the tensile strength of the as-quenched alloys is relatively low and the elongation is as high as 30%.

Two- or three-way observations of the identical cell elements within the same sections by LM, TEM and/or SEM

1978 ◽  
Vol 36 (2) ◽  
pp. 82-83 ◽  
Author(s):  
Nakazo Watari ◽  
Yasuaki Hotta ◽  
Yoshio Mabuchi
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Fine Structure ◽  
Light Microscopy ◽  
Thin Sections ◽  
Transmission Electron ◽  
Identical Cell ◽  
Electron Microscopes ◽  
Scanning Electron

It is very useful if we can observe the identical cell elements within the same sections by light microscopy (LM), transmission electron microscopy (TEM) and/or scanning electron microscopy (SEM) sequentially, because, the cell fine structure can not be indicated by LM, while the color is; on the other hand, the cell fine structure can be very easily observed by EM, although its color properties may not. However, there is one problem in that LM requires thick sections of over 1 μm, while EM needs very thin sections of under 100 nm. Recently, we have developed a new method to observe the same cell elements within the same plastic sections using both light and transmission (conventional or high-voltage) electron microscopes.In this paper, we have developed two new observation methods for the identical cell elements within the same sections, both plastic-embedded and paraffin-embedded, using light microscopy, transmission electron microscopy and/or scanning electron microscopy (Fig. 1).

Comparative Microstructures of Ion Milled and Electrochemically Thinned Composite Materials

1974 ◽  
Vol 32 ◽  
pp. 546-547
Author(s):  
R.R. Russell
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Composite Materials ◽  
Great Difficulty ◽  
Ion Milling ◽  
Transmission Electron ◽  
Ion Damage ◽  
Intermetallic Composite

Transmission electron microscopy of metallic/intermetallic composite materials is most challenging since the microscopist typically has great difficulty preparing specimens with uniform electron thin areas in adjacent phases. The application of ion milling for thinning foils from such materials has been quite effective. Although composite specimens prepared by ion milling have yielded much microstructural information, this technique has some inherent drawbacks such as the possible generation of ion damage near sample surfaces.

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