High performance FPGA controller for digital control of power electronics applications

2009 ◽  
Author(s):  
K. Sugahara ◽  
S. Oida ◽  
T. Yokoyama
Keyword(s):  
Power Electronics ◽  
Digital Control ◽  
High Performance

Double-Sided Microchannel Cooling of a Power Electronics Module Using Power Overlay

2009 ◽  
Author(s):  
Adam G. Pautsch ◽  
Arun Gowda ◽  
Ljubisa Stevanovic ◽  
Rich Beaupre
Keyword(s):  
Power Electronics ◽  
High Performance ◽  
Mechanical Response ◽  
Thermal Contact ◽  
Small Scale ◽  
Micro Channel ◽  
Performance Technology ◽  
Actual Performance ◽  
Low Performance ◽  
Microchannel Cooling

In the continuing effort to alleviate the increasing thermal loads for power electronics devices, numerous aggressive solutions have been developed, such as small-scale micro-channel heat exchangers. Although these methods can improve overall surface heat transfer to the order of 500 W cm−2, they are limited to single-sided cooling due to the typical wire-bonded electrical connections of the devices. Power overlay (POL) technology provides a stable planar structure for electrical connection, as well as attachment of an additional top-side heat exchanger. This study presents an analysis of double-sided microchannel cooling of a power electronics module. Two optimized, integral micro-channel heat sinks were attached above and below silicon power devices, with more traditional attachment on one side and a POL interface on the other. A compliant TIM was selected for low thermal resistance and good mechanical response, which allowed top-side connection to the POL surface. A theoretical model is presented that predicts the benefit of double-sided cooling based on the known performance of a single-sided heat sink and given addition thermal contact resistance for the top side. For microchannels with water, an enhancement of 26% was predicted. An experiment was also carried out to measure the actual performance benefit seen with double-sided cooling. An enhancement of over 30% was measured for a particular design. As the theory predicts, the benefit of double-sided cooling is limited for high performance designs. However, double-sided cooling could lead to high levels of thermal performance using low-performance technology.

scholarly journals HIL evaluation of control unit in grid-tied coverters

2016 ◽  
Vol 20 (suppl. 2) ◽  
pp. 393-406 ◽  
Author(s):  
Vlado Porobic ◽  
Evgenije Adzic ◽  
Milan Rapaic
Keyword(s):  
Power Electronics ◽  
High Performance ◽  
Control Unit ◽  
Active Filters ◽  
Design Tool ◽  
Operating Conditions ◽  
Real Time Control ◽  
Time Control ◽  
Power Electronics Converters ◽  
Grid Connected Converters

Hardware-in-the-Loop (HIL) emulation is poised to become unsurpassed design tool for development, testing, and optimization of real-time control algorithms for grid connected power electronics converters for distributed generation, active filters and smart grid applications. It is strongly important to examine and test how grid connected converters perform under different operating conditions including grid disturbances and faults. In that sense, converter?s controller is a key component responsible for ensuring safe and high-performance operation. This paper demonstrates an example how ultra-low latency and high fidelity HIL emulator is used to easily, rapidly and exhaustively test and validate standard control strategy for grid connected power electronics converters, without need for expensive hardware prototyping and laboratory test equipment.

Robust digital control of a high-performance engine

1992 ◽  
Vol 2 (4) ◽  
pp. 363-383
Author(s):  
Ubaid M. Al-Saggaf
Keyword(s):  
Digital Control ◽  
High Performance
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