Finite element modeling of heat transfer and thermal stresses for three-dimensional packaging of power electronics modules

2002 ◽  
Author(s):  
S.S. Wen ◽  
Guo-Quan Lu
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Finite Element Modeling ◽  
Power Electronics ◽  
Thermal Stresses ◽  
Three Dimensional ◽  
Element Modeling

scholarly journals Finite element modeling of coating thickness using heat transfer method

2021 ◽  
Vol 32 ◽  
pp. 249-256
Author(s):  
Yafeng Li ◽  
Anvesh Dhulipalla ◽  
Jian Zhang ◽  
Hye-Yeong Park ◽  
Yeon-Gil Jung ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Finite Element ◽  
Finite Element Modeling ◽  
Coating Thickness ◽  
Element Modeling ◽  
Transfer Method

Three-Dimensional Finite Element Modeling of Drilling Processes

2006 ◽  
Author(s):  
T. D. Marusich ◽  
S. Usui ◽  
R. Aphale ◽  
N. Saini ◽  
R. Li ◽  
...  
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Three Dimensional ◽  
Constitutive Models ◽  
Simulation Software ◽  
Process Conditions ◽  
Third Wave ◽  
Element Modeling ◽  
Drill Point ◽  
Three Dimensional Finite Element

The three dimensional (3D) finite element modeling (FEM) and experimental validation of drilling are presented. The Third Wave AdvantEdge machining simulation software is applied for the FEM. It includes fully adaptive unstructured mesh generation, thermo-mechanically coupling, deformable tool-chip-workpiece contact, interfacial heat transfer across the tool-chip boundary, and constitutive models appropriate for process conditions and finite deformation analyses. The workpiece is modeled with a predrilled cone-shape blind hole to enable the early full-engagement of the whole drill point region to reduce the simulation time. Drilling experiments are conducted on the Ti-6Al-4V using a twist drill geometry. The calculated cutting force and torque are compared with the results of experiments with good agreement. Effects of process parameters on the stress and temperature distributions of the drill and workpiece are investigated in detail using the FEM.

Combining Serial Sectioning, EBSD Analysis, and Image-Based Finite Element Modeling

MRS Bulletin ◽  
2008 ◽  
Vol 33 (6) ◽  
pp. 597-602 ◽  
Author(s):  
G. Spanos ◽  
D.J. Rowenhorst ◽  
A.C. Lewis ◽  
A.B. Geltmacher
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Electron Backscatter Diffraction ◽  
Three Dimensional ◽  
Research Area ◽  
Polycrystalline Materials ◽  
Serial Sectioning ◽  
3D Fem ◽  
Element Modeling ◽  
The Status

AbstractThis article first provides a brief review of the status of the subfield of three-dimensional (3D) materials analyses that combine serial sectioning, electron backscatter diffraction (EBSD), and finite element modeling (FEM) of materials microstructures, with emphasis on initial investigations and how they led to the current state of this research area. The discussions focus on studies of the mechanical properties of polycrystalline materials where 3D reconstructions of the microstructure—including crystallographic orientation information—are used as input into image-based 3D FEM simulations. The authors' recent work on a β-stabilized Ti alloy is utilized for specific examples to illustrate the capabilities of these experimental and modeling techniques, the challenges and the solutions associated with these methods, and the types of results and analyses that can be obtained by the close integration of experiments and simulations.

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