High frequency SEPIC-WEIBERG converter for space applications

2016 ◽  
Author(s):  
N. Muhammad Ibrahim ◽  
J. Venkata Gangadhar ◽  
M. Partho ◽  
K. Deepa
Keyword(s):  
High Frequency ◽  
Space Applications

Vibration Isolator Design for Space Application Based on Multiobjective Optimization Method

2013 ◽  
Vol 365-366 ◽  
pp. 77-81
Author(s):  
Zhi Wei Feng ◽  
Qian Gang Tang ◽  
Qing Bin Zhang
Keyword(s):  
Multiobjective Optimization ◽  
High Frequency ◽  
Optimization Problems ◽  
Optimization Method ◽  
Resonant Peak ◽  
Space Application ◽  
Vibration Isolator ◽  
Peak Reduction ◽  
Space Applications ◽  
Design Variables

A multiobjective optimization based vibration isolator design for space application is described. It is common to use passive isolator and isolate the platform noise in space applications. The design of a passive isolator involves a trade-off between the resonant peak reduction and the high frequency attenuation. The equation of motion and transfer function model for single-stage and two-stage connector model is derived by using basic principle. The multiobjective optimization model is proposed, where the design variables are the damping coefficients and stiffness coefficients, the objective functions are the resonant peak reduction and the high frequency attenuation, and the constraints are the natural frequency of the connector. The multiobjective optimization problems for the design of the passive isolator are solved by using the multiobjective evolutionary algorithm based on decomposition (MOEA/D). The Pareto front obtained can provide multiple candidate solutions for the designer. The method is effective for the design process of the passive isolator.

PERFORMANCE EVALUATION OF GOLD (Au) WIRE AND RIBBON INTERCONNECTS IN HIGH FREQUENCY CIRCUITS

2016 ◽  
Vol 2016 (1) ◽  
pp. 000450-000455
Author(s):  
Cenk Atalan ◽  
Taylan Eker
Keyword(s):  
High Frequency ◽  
High Performance ◽  
Substrate Material ◽  
Circuit Board ◽  
Pure Gold ◽  
Frequency Range ◽  
Space Applications ◽  
Test Circuit ◽  
Bonding Method ◽  
A Performance

Abstract Gold (Au) wires and ribbons are widely being used in military and space applications of high frequency RF/microwave circuits. The purpose of this study is to examine the RF performance of different dimensions of Au wires & ribbons, which are typically bonded in cascade and parallel forms in the circuits operating microwave frequencies within 0–50 GHz. The second goal of this study is to establish a performance chart/handbook of Au wires, ribbons for high frequency circuit designers in order to show them which type of wire or ribbon as well as which type of interconnect form is suitable for their intended design. First, the test circuit board is manufactured by using chip & wire, epoxy attach method. The substrate material of used RF circuit materials is chosen as Alumina to minimize losses and the material of wires, ribbons are chosen as %99.99 pure Gold (Au). Au plated copper traces are used as conductive layers for optimal reliability and conductivity in the test circuit board. Automated thermosonic ball bonders are used for Au round wire bonds to reduce process errors. Manual parallel gap resistance welders and manual thermosonic wedge bonders are used for Au ribbons and always pay great attention to form the same length by using high magnification microscopes. The experiment conducted with the help of 0.7 mil, 1 mil round wires and 3×0.5 mil, 3×1 mil, 5×0.5 mil, 7×1 mil and 10×1 mil ribbons. Single bonds, parallel double bonds as well as V-type bonds, stitch over ball bonds are performed onto the circuit pads as interconnect types and forms. The RF tests (S11 return losses and S21 insertion loss) we performed showed that 0.7 mil and 1 mil round wires can be used in the frequency range of 0–20 GHz circuits. A better RF test result can be achieved if double parallel bonding method is used. For higher frequency range, 20 to 50 GHz, 3×0.5 mil, 3×1 mil, 7×1 mil and 10×1 mil ribbons should be used. On the other hand, the bare chip bonding pads and dimensions of transmission line conductive layer bond pads are limiting the usage of desired ribbon. Last but not least, a performance chart of RF wire/ribbon interconnects including a suggestion of bonding method with sustainable current load and shape is generated for design and application engineers who are dealing with high performance circuit efficiency.

scholarly journals Design of High Frequency Pulse Tube Cryocooler for Onboard Space Applications

2017 ◽  
Vol 171 ◽  
pp. 012081
Author(s):  
Thota Srikanth ◽  
Padmanabhan ◽  
C S Gurudath ◽  
A Amrit ◽  
S Basavaraj ◽  
...  
Keyword(s):  
High Frequency ◽  
Pulse Tube ◽  
Space Applications ◽  
Pulse Tube Cryocooler ◽  
Frequency Pulse

scholarly journals Design of RF MEMS based switch matrix for space applications

2013 ◽  
Vol 11 ◽  
pp. 143-152 ◽  
Author(s):  
S. Di Nardo ◽  
P. Farinelli ◽  
T. Kim ◽  
R. Marcelli ◽  
B. Margesin ◽  
...  
Keyword(s):  
Design Process ◽  
High Frequency ◽  
Return Loss ◽  
Rf Mems ◽  
Space Applications ◽  
Simulated Performance ◽  
Benes Network ◽  
Matrix Design ◽  
Better Than ◽  
Ku Band

Abstract. RF MEMS based switch matrices have several advantages compared to the mechanical or solid-state switch based ones for space applications. They are compact, light and less lossy with a high linearity up to high frequency. In this work, a 12 × 12 switch matrix with RF MEMS and LTCC technologies is presented based on the planar Beneš network. The simulated performance of the 12 × 12 switch matrix is below −12 dB IL (Insertion Loss) up to C band and −15 dB RL (Return Loss) up to Ku band. Moreover, it has a good isolation better than −50 dB. A 4 × 4 switch matrix with the same design process and technologies is fabricated and measured to verify the 12 × 12 switch matrix design process. The measured performance agrees very well to the simulations.

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