Observation and Effective Suppression of Dielectric Relaxation in Charge-Trap NAND Flash Memory

Author(s):  
Jae Sung Sim ◽  
Jungdal Choi ◽  
Changseok Kang ◽  
Youngwoo Park ◽  
Jintaek Park ◽  
...  
Author(s):  
Ting Cheng ◽  
Jianquan Jia ◽  
Lei Jin ◽  
Xinlei Jia ◽  
Shiyu Xia ◽  
...  

Micromachines ◽  
2021 ◽  
Vol 12 (10) ◽  
pp. 1152
Author(s):  
Fei Chen ◽  
Bo Chen ◽  
Hongzhe Lin ◽  
Yachen Kong ◽  
Xin Liu ◽  
...  

Temperature effects should be well considered when designing flash-based memory systems, because they are a fundamental factor that affect both the performance and the reliability of NAND flash memories. In this work, aiming to comprehensively understanding the temperature effects on 3D NAND flash memory, triple-level-cell (TLC) mode charge-trap (CT) 3D NAND flash memory chips were characterized systematically in a wide temperature range (−30~70 °C), by focusing on the raw bit error rate (RBER) degradation during program/erase (P/E) cycling (endurance) and frequent reading (read disturb). It was observed that (1) the program time showed strong dependences on the temperature and P/E cycles, which could be well fitted by the proposed temperature-dependent cycling program time (TCPT) model; (2) RBER could be suppressed at higher temperatures, while its degradation weakly depended on the temperature, indicating that high-temperature operations would not accelerate the memory cells’ degradation; (3) read disturbs were much more serious at low temperatures, while it helped to recover a part of RBER at high temperatures.


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