Advanced materials with low dielectric properties and highly thermal conductivity

2016 ◽  
Author(s):  
Wen-Pin Ting ◽  
Feng-Po Tseng ◽  
Kuo-Chan Chiou
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Properties ◽  
Advanced Materials ◽  
Low Dielectric

scholarly journals Synergistic Effects of Boron Nitride (BN) Nanosheets and Silver (Ag) Nanoparticles on Thermal Conductivity and Electrical Properties of Epoxy Nanocomposites

Polymers ◽  
2020 ◽  
Vol 12 (2) ◽  
pp. 426 ◽  
Author(s):  
Yunjian Wu ◽  
Xiaoxing Zhang ◽  
Ankit Negi ◽  
Jixiong He ◽  
Guoxiong Hu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Properties ◽  
Boron Nitride ◽  
Polymer Composites ◽  
Synergistic Effects ◽  
High Thermal Conductivity ◽  
Epoxy Nanocomposites ◽  
Transfer Path ◽  
Low Dielectric ◽  
Low Permittivity

Polymer composites, with both high thermal conductivity and high electrical insulation strength, are desirable for power equipment and electronic devices, to sustain increasingly high power density and heat flux. However, conventional methods to synthesize polymer composites with high thermal conductivity often degrade their insulation strength, or cause a significant increase in dielectric properties. In this work, we demonstrate epoxy nanocomposites embedded with silver nanoparticles (AgNPs), and modified boron nitride nanosheets (BNNSs), which have high thermal conductivity, high insulation strength, low permittivity, and low dielectric loss. Compared with neat epoxy, the composite with 25 vol% of binary nanofillers has a significant enhancement (~10x) in thermal conductivity, which is twice of that filled with BNNSs only (~5x), owing to the continuous heat transfer path among BNNSs enabled by AgNPs. An increase in the breakdown voltage is observed, which is attributed to BNNSs-restricted formation of AgNPs conducting channels that result in a lengthening of the breakdown path. Moreover, the effects of nanofillers on dielectric properties, and thermal simulated current of nanocomposites, are discussed.

scholarly journals Sintering, Microstructure, and Dielectric Properties of Copper Borates for High Frequency LTCC Applications

Materials ◽  
2021 ◽  
Vol 14 (14) ◽  
pp. 4017
Author(s):  
Dorota Szwagierczak ◽  
Beata Synkiewicz-Musialska ◽  
Jan Kulawik ◽  
Norbert Pałka
Keyword(s):  
Dielectric Properties ◽  
Dielectric Permittivity ◽  
High Frequency ◽  
Ceramic Materials ◽  
Sintering Behavior ◽  
Terahertz Time Domain Spectroscopy ◽  
Very High Frequency ◽  
X Ray ◽  
Low Dielectric ◽  
Very High

New ceramic materials based on two copper borates, CuB2O4 and Cu3B2O6, were prepared via solid state synthesis and sintering, and characterized as promising candidates for low dielectric permittivity substrates for very high frequency circuits. The sintering behavior, composition, microstructure, and dielectric properties of the ceramics were investigated using a heating microscope, X-ray diffractometry, scanning electron microscopy, energy dispersive spectroscopy, and terahertz time domain spectroscopy. The studies revealed a low dielectric permittivity of 5.1–6.7 and low dielectric loss in the frequency range 0.14–0.7 THz. The copper borate-based materials, owing to a low sintering temperature of 900–960 °C, are suitable for LTCC (low temperature cofired ceramics) applications.

Thermal stable honokiol-derived epoxy resin with reinforced thermal conductivity, dielectric properties and flame resistance

2021 ◽  
Vol 412 ◽  
pp. 128647
Author(s):  
Jingjing Meng ◽  
Pengfei Chen ◽  
Rui Yang ◽  
Linli Dai ◽  
Cheng Yao ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Properties ◽  
Epoxy Resin ◽  
Flame Resistance ◽  
Thermal Stable

scholarly journals Novel Polyimide/Copper-Nickel Ferrite Composites with Tunable Magnetic and Dielectric Properties

Polymers ◽  
2021 ◽  
Vol 13 (10) ◽  
pp. 1646
Author(s):  
Corneliu Hamciuc ◽  
Mihai Asandulesa ◽  
Elena Hamciuc ◽  
Tiberiu Roman ◽  
Marius Andrei Olariu ◽  
...  
Keyword(s):  
Dielectric Properties ◽  
Nickel Ferrite ◽  
Scanning Calorimetry ◽  
X Ray ◽  
Broadband Dielectric Spectroscopy ◽  
Copper Nickel ◽  
Low Dielectric ◽  
Magnetic Remanence ◽  
Polyimide Matrix ◽  
Ferrite Composites

Heat-resistant magnetic polymer composites were prepared by incorporating cerium-doped copper-nickel ferrite particles, having the general formula Ni1-xCuxFe1.92Ce0.08O4 (x: 0.0, 0.3, 0.6, 1.0), into a polyimide matrix. The effects of particle type and concentration on the thermal, magnetic, and electrical properties of the resulting composites were investigated. The samples were characterized by FTIR, scanning electron microscopy, X-ray diffractometry, thermogravimetric analysis, differential scanning calorimetry, vibrating sample magnetometer, and broadband dielectric spectroscopy. The composites exhibited high thermal stability, having initial decomposition temperatures between 495 and 509 °C. Saturation magnetization (Ms), magnetic remanence (Mr), and coercivity (Hc) were found in range of 2.37–10.90 emu g−1, 0.45–2.84 emu g−1, and 32–244 Oe, respectively. The study of dielectric properties revealed dielectric constant values of 3.0–4.3 and low dielectric losses of 0.016–0.197 at room temperature and a frequency of 1 Hz.

Novel soluble polyimides containing pyridine and fluorinated units: preparation, characterization, and optical and dielectric properties

RSC Advances ◽  
2016 ◽  
Vol 6 (26) ◽  
pp. 21662-21671 ◽  
Author(s):  
Weibing Dong ◽  
Yue Guan ◽  
Dejing Shang
Keyword(s):  
Dielectric Constant ◽  
Thermal Properties ◽  
Dielectric Properties ◽  
Low Dielectric Constant ◽  
Mechanical And Thermal Properties ◽  
Polyimide Films ◽  
Low Dielectric

To acquire low dielectric constant polyimide films with good mechanical and thermal properties and low CTE applied in microelectronic fields, three novel polyimides containing pyridine and –C(CF3)2– groups were firstly designed and synthesized.

Polyimide-Silica Hybrid Aerogels with High Mechanical Strength for Thermal Insulation Applications

2011 ◽  
Vol 1306 ◽  
Author(s):  
Wenting Dong ◽  
Wendell Rhine ◽  
Shannon White
Keyword(s):  
Thermal Conductivity ◽  
High Performance ◽  
Ambient Conditions ◽  
Separation Membranes ◽  
Low Dielectric ◽  
Aging Conditions ◽  
Hybrid Aerogels ◽  
Mechanical Strengths ◽  
The Relationship ◽  
Silica Hybrid

ABSTRACTHigh performance polyimides have been widely investigated as materials with excellent thermal, mechanical, and electronic properties due to their highly rigid structures. Aspen has developed an approach to prepare polyimide aerogels which have applications as low dielectric constant materials, separation membranes, catalyst supports and insulation materials. In this paper, we will discuss the preparation of polyimide-silica hybrid aerogel materials with good mechanical strengths and low thermal conductivities. The polyimide-silica hybrid aerogels were made by a two-step process and the materials were characterized to determine thermal conductivity and compressive strength. Results show that compressive moduli of the polyimide-silica hybrid aerogels increase dramatically with density (power law relationship). Thermal conductivity of the aerogels is dependent on the aging conditions and density, with the lowest value achieved so far being ~12 mW/m-K at ambient conditions. The relationship between aerogel density and surface area, thermal stability, porosity and morphology of the nanostructure of the polyimide-silica hybrid aerogels are also described in this paper.

Enhanced dielectric properties and thermal conductivity of Al/CNTs/PVDF ternary composites

2015 ◽  
Vol 34 (14) ◽  
pp. 1126-1135 ◽  
Author(s):  
Zijun Wang ◽  
Wenying Zhou ◽  
Xuezhen Sui ◽  
Lina Dong
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Properties
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