Wearout reliability study of Cu and Au wires used in flash memory fine line BGA package

2012 ◽  
Author(s):  
CL Gan ◽  
EK Ng ◽  
BL Chan ◽  
T. Kwuanjai ◽  
S. Jakarin ◽  
...  
Keyword(s):  
Flash Memory ◽  
Reliability Study ◽  
Fine Line ◽  
Bga Package

Performance and Reliability Study of Single-Layer and Dual-Layer Platinum Nanocrystal Flash Memory Devices Under NAND Operation

2010 ◽  
Vol 57 (8) ◽  
pp. 1829-1837 ◽  
Author(s):  
Pawan K. Singh ◽  
Gaurav Bisht ◽  
Kshitij Auluck ◽  
M. Sivatheja ◽  
Ralf Hofmann ◽  
...  
Keyword(s):  
Flash Memory ◽  
Single Layer ◽  
Memory Devices ◽  
Reliability Study

Failure Analysis and Reliability Study of NAND Flash-Based Solid State Drives

2016 ◽  
Vol 2 (2) ◽  
pp. 315 ◽  
Author(s):  
R. Sayyad ◽  
Sangram Redkar
Keyword(s):  
Solid State ◽  
Failure Analysis ◽  
Flash Memory ◽  
Fault Tree Analysis ◽  
Physical Nature ◽  
Systematic Evaluation ◽  
Nand Flash ◽  
Solid State Drives ◽  
Nand Flash Memory ◽  
Reliability Study

<p>The research focuses on conducting failure analysis and reliability study to understand and analyze the root cause of Quality, Endurance component Reliability Demonstration Test (RDT) failures and determine SSD performance capability. It addresses essential challenges in developing techniques that utilize solid-state memory technologies (with emphasis on NAND flash memory) from device, circuit, architecture, and system perspectives. These challenges include not only the performance degradation arising from the physical nature of NAND flash memory, e.g., the inability to modify data in-place read/write performance asymmetry, and slow and constrained erase functionality, but also the reliability drawbacks that limits Solid State Drives (SSDs) performance.  In order to understand the nature of failures, a Fault Tree Analysis (FTA) was performed that identified the potential causes of component failures. In the course of this research, significant data gathering and analysis effort was carried out that led to a systematic evaluation of the components under consideration. </p>

Validity and Reliability Study of the Strength Self-Efficacy Scale

2010 ◽  
Author(s):  
Ran Zhao ◽  
Chia-Lin Tsai ◽  
Adipat Chaichanasakul ◽  
Lisa Y. Flores ◽  
Shane J. Lopez
Keyword(s):  
Self Efficacy ◽  
Validity And Reliability ◽  
Reliability Study

Novel Three Dimensional (3D) NAND Flash Memory Array Having Tied Bit-line and Ground Select Transistor (TiGer)

2012 ◽  
Vol E95.C (5) ◽  
pp. 837-841 ◽  
Author(s):  
Se Hwan PARK ◽  
Yoon KIM ◽  
Wandong KIM ◽  
Joo Yun SEO ◽  
Hyungjin KIM ◽  
...  
Keyword(s):  
Flash Memory ◽  
Three Dimensional ◽  
Nand Flash ◽  
Nand Flash Memory ◽  
Memory Array

Optical Connection between Optical Via Hole in BGA Package and Optical Waveguide on Board

2009 ◽  
Vol E92-C (2) ◽  
pp. 239-246 ◽  
Author(s):  
Keiko ODA ◽  
Takahiro MATSUBARA ◽  
Kei-ichiro WATANABE ◽  
Kaori TANAKA ◽  
Maraki MAETANI
Keyword(s):  
Optical Waveguide ◽  
Bga Package ◽  
Via Hole ◽  
Optical Connection
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