High power LED thermal performance test analysis and its research methods

2011 ◽  
Author(s):  
Hong min Wang ◽  
Haibo Li ◽  
Hua Chen ◽  
Yu Cao
Keyword(s):  
Research Methods ◽  
Thermal Performance ◽  
High Power ◽  
Performance Test ◽  
Test Analysis ◽  
High Power Led

Development and thermal performance of a vapor chamber with multi-artery reentrant microchannels for high-power LED

2020 ◽  
Vol 166 ◽  
pp. 114686 ◽  
Author(s):  
Liang Chen ◽  
Daxiang Deng ◽  
Qingsong Huang ◽  
Xinhai Xu ◽  
Yingxi Xie
Keyword(s):  
Thermal Performance ◽  
High Power ◽  
Vapor Chamber ◽  
High Power Led

The Application of Heat Pipe Heat Sink for High Power LED Lamps

2014 ◽  
Vol 602-605 ◽  
pp. 2713-2716 ◽  
Author(s):  
Xin Rui Ding ◽  
Yu Ji Li ◽  
Zong Tao Li ◽  
Yong Tang ◽  
Bin Hai Yu ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Heat Sinks ◽  
Practical Significance ◽  
Heat Accumulation ◽  
Element Analysis ◽  
High Power Led

LED has been regarded as the next generation lighting source. As for high power LED lamps, heat accumulation will cause a series of problems. Therefore, thermal management is very important for designing a high power LED lamp. Three types of heat sinks are designed by using the finite element analysis (FEA) method for an 180W high power LED lamp. Then the optimized heat sinks are developed and experiments are performed to demonstrate the simulated results. At the same time, the thermal performances with different working angles are investigated experimentally. The heat sink with heat pipe has a better heat dissipation performance than the conventional heat sink under the same input power. The working angles of the lamps greatly influence the thermal performance of each heat sink. For the same heat sink, the temperature varies with different install directions and working angles. Finally, the heat sink with the best thermal performance is recommended. The results have practical significance in designing high power LED lamps.

Thermal Performance Comparison of Thick-Film Insulated Aluminum Substrates With Metal Core PCBs for High-Power LED Modules

2012 ◽  
Vol 2 (12) ◽  
pp. 1957-1964 ◽  
Author(s):  
Eveliina Juntunen ◽  
Aila Sitomaniemi ◽  
Olli Tapaninen ◽  
Ryan Persons ◽  
Mark Challingsworth ◽  
...  
Keyword(s):  
Thick Film ◽  
Thermal Performance ◽  
High Power ◽  
Performance Comparison ◽  
Metal Core ◽  
High Power Led ◽  
Aluminum Substrates

Thermal Management for High Power Light-Emitting Diode Street Lamp

2010 ◽  
Author(s):  
M. Ying ◽  
S. M. L. Nai ◽  
P. Shi ◽  
J. Wei ◽  
C. K. Cheng ◽  
...  
Keyword(s):  
Thermal Management ◽  
Thermal Performance ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
System Level ◽  
Light Emitting ◽  
High Power Led ◽  
Street Lamp ◽  
Lamp System

Light-emitting diode (LED) street lamp has gained its acceptance rapidly in the lighting system as one of choices for low power consumption, high reliability, dimmability, high operation hours, and good color rendering applications. However, as the LED chip temperature strongly affects the optical extraction and the reliability of the LED lamps, LED street lamp performance is heavily relied on a successful thermal management, especially when applications require LED street lamp to operate at high power and hash environment to obtain the desired brightness. As such, a well-designed thermal management, which can lower the LED chip operation temperature, becomes one of the necessities when developing LED street lamp system. The current study developed an effective heat dissipation method for the high power LED street lamp with the consideration of design for manufacturability. Different manufacturable structure designs were proposed for the high power street lamp. The thermal contact conductance between aluminum interfaces was measured in order to provide the system assembly guidelines. The module level thermal performance was also investigated with thermocouples. In addition, finite element (FE) models were established for the temperature simulation of both the module and lamp system. The coefficient of natural convection of the heat sink surface was determined by the correlation of the measurement and simulation results. The system level FE model was employed to optimize and verify the heat dissipation concepts numerically. An optimized structure design and prototype has shown that the high power LED street lamp system can meet the thermal performance requirements.

Study on thermal performance of high power LED employing aluminum filled epoxy composite as thermal interface material

2014 ◽  
Vol 45 (12) ◽  
pp. 1726-1733 ◽  
Author(s):  
P. Anithambigai ◽  
S. Shanmugan ◽  
D. Mutharasu ◽  
T. Zahner ◽  
D. Lacey
Keyword(s):  
Thermal Performance ◽  
High Power ◽  
Epoxy Composite ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
High Power Led
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