A Scale-Invariant Diffusion Distance for Non-rigid Shape Analysis

2014 ◽  
Author(s):  
Kang Wang ◽  
Zhongke Wu ◽  
Taorui Jia ◽  
Sajid Ali ◽  
Junli Zhao ◽  
...  
Keyword(s):  
Shape Analysis ◽  
Diffusion Distance ◽  
Scale Invariant

Banana cultivar classification using scale invariant shape analysis

2017 ◽  
Author(s):  
Kwankamon Dittakan ◽  
Nawanol Theera-Ampornpunt ◽  
Waraphon Witthayarat ◽  
Sararat Hinnoy ◽  
Supawit Klaiwan ◽  
...  
Keyword(s):  
Shape Analysis ◽  
Scale Invariant ◽  
Cultivar Classification ◽  
Invariant Shape ◽  
Banana Cultivar

Scale-Invariant Heat Kernel Mapping for Shape Analysis

2016 ◽  
pp. 74-90
Author(s):  
Kang Wang ◽  
Zhongke Wu ◽  
Sajid Ali ◽  
Junli Zhao ◽  
Taorui Jia ◽  
...  
Keyword(s):  
Heat Kernel ◽  
Shape Analysis ◽  
Scale Invariant ◽  
Kernel Mapping

3D CT Cephalometry of Plagiocephaly: Asymmetry and Shape Analysis

2005 ◽  
Author(s):  
David Netherway ◽  
Amanda Abbott ◽  
Nadim Gulamhuseinwala ◽  
Karen McGlaughlin ◽  
Peter Anderson ◽  
...  
Keyword(s):  
Shape Analysis ◽  
3D Ct

Intermittent Failures in High Pin Count Packaging

2006 ◽  
Author(s):  
Ramesh Varma ◽  
Richard Brooks ◽  
Ronald Twist ◽  
James Arnold ◽  
Cleston Messick
Keyword(s):  
Failure Analysis ◽  
Shape Analysis ◽  
State Of The Art ◽  
Process Variation ◽  
High Reliability ◽  
Temperature Cycling ◽  
Assembly Process ◽  
System Failures ◽  
Industrial Grade ◽  
Corrective Actions

Abstract In a prequalification effort to evaluate the assembly process for the industrial grade high pin count devices for use in a high reliability application, one device exhibited characteristics that, without corrective actions and/or extensive screening, may lead to intermittent system failures and unacceptable reliability. Five methodologies confirmed this conclusion: (1) low post-decapsulation wire pull results; (2) bond shape analysis showed process variation; (3) Failure Analysis (FA) using state of the art equipment determined the root causes and verified the low wire pull results; (4) temperature cycling parts while monitoring, showed intermittent failures, and (5) parts tested from other vendors using the same techniques passed all limits.

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