Bus-Based Tree Structures for Efficient Parallel Computation

Author(s):  
O. M. Dighe ◽  
R. Vaidyanathan ◽  
S. Q. Zheng
2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.


2014 ◽  
Vol E97.C (7) ◽  
pp. 661-669
Author(s):  
Ying YAN ◽  
Xunwang ZHAO ◽  
Yu ZHANG ◽  
Changhong LIANG ◽  
Zhewang MA

Author(s):  
Giorgio Franceschetti ◽  
Pasquale Imperatore ◽  
Antonio Iodice ◽  
Daniele Riccio

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