Design and Optimization Analysis of Composite Water Cooling System Based On High Power Density Motor

Author(s):  
Shaopeng Wu ◽  
Chenchen Tian ◽  
Pinjia Zhang ◽  
Xiaojian Huang ◽  
Xinyue Shan
2008 ◽  
Vol 600-603 ◽  
pp. 1223-1226 ◽  
Author(s):  
Shin Ichi Kinouchi ◽  
Hiroshi Nakatake ◽  
T. Kitamura ◽  
S. Azuma ◽  
S. Tominaga ◽  
...  

A compact SiC converter having power densities about 9 W/cm3 is designed and fabricated. It is confirmed that the converter operates in a thermally permissive range. The power loss of the module of the converter measured under motor operations is less than 50% of the similar-rating Si module loss. The shrink of the effective volume of DC-link capacitor is necessary to achieve the high power-density SiC converter, in addition to the decrease of the cooling system volume due to the loss reduction caused by SiC devices.


AIChE Journal ◽  
2017 ◽  
Vol 64 (2) ◽  
pp. 782-795 ◽  
Author(s):  
Meng Yue ◽  
Qiong Zheng ◽  
Feng Xing ◽  
Huamin Zhang ◽  
Xianfeng Li ◽  
...  

2019 ◽  
Vol 29 (10) ◽  
pp. 3893-3907
Author(s):  
Yuanlong Chen ◽  
Tingbo Hou ◽  
Xiaochao Zhou

Purpose The purpose of this paper is to ensure adequate thermal management to remove and dissipate the heat produced by a light-emitting diode (LED) and to guarantee reliable and safe operation. Design/methodology/approach A three-dimensional (3-D) computational fluid dynamics (CFD) model was used to analyze the distribution of fluid velocities among microchannels at four different aspect ratios. Findings The results showed that at the same inlet flow rate, the larger the aspect ratio of the microchannels, the better the uniformity of the internal fluid velocity and thus better the heat dissipation performance on the surface of the high-power LED chip. In addition, the thermal performance of a high-power LED water cooling system with four different aspect ratios’ microchannel structures is further studied experimentally. Specifically, the coupling effect between the fluid velocity distribution in the microchannels and the heat dissipation performance of a high-power LED water cooling system is qualitatively analyzed and compared with the simulation results of the fluid velocity distribution. The results fully demonstrated that a larger aspect ratio of the microchannels results in better heat dissipation performance on the surface of the high-power LED chip. Originality/value Optimizing the structural parameters to facilitate a relatively uniform velocity distribution to improve the water cooling system performance may be a key factor to be considered.


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