Design of high reliability packaging for Fuji High Power Module

2011 ◽  
Author(s):  
S. Igarashi ◽  
H. Kakiki ◽  
Y. Nishimura ◽  
T. Goto
Keyword(s):  
High Power ◽  
High Reliability ◽  
Power Module

Assembly Reliability and Molding Material Comparison of Miniature Integrated High Power Module with Insulated Metal Substrate

2021 ◽  
Author(s):  
Chang-Chun Lee ◽  
Kuo-Shu Kao ◽  
Chi-Wei Wang ◽  
Tai-Jyun Yu ◽  
Tai-Kuang Lee ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
High Reliability ◽  
Metal Substrate ◽  
Temperature Cycling ◽  
Power Module ◽  
Silicone Gel ◽  
Molding Material ◽  
Operational Life ◽  
Solder Layer

Abstract Given the increasing demand for power density and lightweight specifications, the discrete transistor outline-type package is no longer sufficient for personal vehicle. The new generation of high-power drive needs excellent heat dissipation and miniaturized system simultaneously. However, a traditional architecture of power module, direct bonding copper substrate, has serious warpage deformation and limitation of the heat dissipation. Therefore, a power module with an insulated metal substrate (IMS) is proposed. The proposed power module has a smaller volume, better electrical and thermal performance, and high reliability to be utilized in personal vehicles. A fine-quality assembly process is also presented and verified. Furthermore, two different kinds of molding materials that are widely used in power modules, silicone gel and epoxy, are utilized. The IMS-type module with silicone gel molding fails the temperature cycling test (TCT) with the delamination of the solder layer. The module with epoxy successfully passes the automotive-grade reliability tests, including TCT, highly accelerated stress test, high-temperature reverse bias, and intermittent operational life test according to the standard of AEC-Q101. The finite element analysis for the IMS power module is presented and analyzed under the condition of TCT to estimate the mechanical behavior of the solder layer. The equivalent plastic strain of solder layer with silicone gel and epoxy are 0.76 and 0.08 after TCT, separately. The main reason can be attributed to the coefficient of thermal expansion between the IMS and molding material. According to the analyzed results, the effect of molding material should not be ignored in the power modulus.

scholarly journals Space High-Voltage Power Module

2021 ◽  
Vol 9 ◽  
Author(s):  
Wenjie Zhao ◽  
Yuanyuan Jiang ◽  
Jianchao Wu ◽  
Yonghui Huang ◽  
Yan Zhu ◽  
...  
Keyword(s):  
High Voltage ◽  
High Power ◽  
Power Supply ◽  
Electric Propulsion ◽  
High Reliability ◽  
Rapid Development ◽  
Space Environment ◽  
Resonant Circuit ◽  
Power Module ◽  
High Voltage Power Supply

With the rapid development of the world’s aerospace technologies, a high-power and high-reliability space high-voltage power supply is significantly required by new generation of applications, including high-power electric propulsion, space welding, deep space exploration, and space solar power stations. However, it is quite difficult for space power supplies to directly achieve high-voltage output from the bus, because of the harshness of the space environment and the performance limitations of existing aerospace-grade electronic components. This paper proposes a high-voltage power supply module design for space welding applications, which outputs 1 kV and 200 W when the input is 100 V. This paper also improves the efficiency of the high-voltage converter with a phase-shifted full-bridge series resonant circuit, then simulates the optimized power module and the electric field distribution of the high-voltage circuit board.

High Power UPS Selection Methodology and Installation Guideline for High Reliability Power Supply

2005 ◽  
Vol 1 (03) ◽  
pp. 396-402
Author(s):  
A. Sudrià ◽  
◽  
E. Jaureguialzo ◽  
A. Samper ◽  
R. Villafáfila ◽  
...  
Keyword(s):  
High Power ◽  
Power Supply ◽  
High Reliability ◽  
Selection Methodology

scholarly journals Cell/Module Integration Technology with Wire-Embedded EVA Sheet

2021 ◽  
Vol 11 (9) ◽  
pp. 4170
Author(s):  
Jeong Eun Park ◽  
Won Seok Choi ◽  
Donggun Lim
Keyword(s):  
Solar Cells ◽  
Solar Cell ◽  
High Power ◽  
Short Circuit ◽  
Optical Loss ◽  
Manufacturing Cost ◽  
Power Module ◽  
Manufacturing Method ◽  
Front Electrode ◽  
The Wire

Silicon wafers are crucial for determining the price of solar cell modules. To reduce the manufacturing cost of photovoltaic devices, the thicknesses of wafers are reduced. However, the conventional module manufacturing method using the tabbing process has a disadvantage in that the cell is damaged because of the high temperature and pressure of the soldering process, which is complicated, thus increasing the process cost. Consequently, when the wafer is thinned, the breakage rate increases during the module process, resulting in a lower yield; further, the module performance decreases owing to cracks and thermal stress. To solve this problem, a module manufacturing method is proposed in which cells and wires are bonded through the lamination process. This method minimizes the thermal damage and mechanical stress applied to solar cells during the tabbing process, thereby manufacturing high-power modules. When adopting this method, the front electrode should be customized because it requires busbarless solar cells different from the existing busbar solar cells. Accordingly, the front electrode was designed using various simulation programs such as Griddler 2.5 and MathCAD, and the effect of the diameter and number of wires in contact with the front finger line of the solar cell on the module characteristics was analyzed. Consequently, the efficiency of the module manufactured with 12 wires and a wire diameter of 0.36 mm exhibited the highest efficiency at 20.28%. This is because even if the optical loss increases with the diameter of the wire, the series resistance considerably decreases rather than the loss of the short-circuit current, thereby improving the fill factor. The characteristics of the wire-embedded ethylene vinyl acetate (EVA) sheet module were confirmed to be better than those of the five busbar tabbing modules manufactured by the tabbing process; further, a high-power module that sufficiently compensated for the disadvantages of the tabbing module was manufactured.

Design and Characteristics of Microfocus X-ray Source with Sealed Tube and Transmissive Target on Diamond Window

2021 ◽  
Vol 79 (6) ◽  
pp. 631-640
Author(s):  
Takaaki Tsunoda ◽  
Takeo Tsukamoto ◽  
Yoichi Ando ◽  
Yasuhiro Hamamoto ◽  
Yoichi Ikarashi ◽  
...  
Keyword(s):  
Power Density ◽  
High Power ◽  
High Speed ◽  
Electronic Device ◽  
High Reliability ◽  
Electronic Devices ◽  
Lithium Ion ◽  
High Power Density ◽  
High Magnification ◽  
X Ray

Electronic devices such as medical instruments implanted in the human body and electronic control units installed in automobiles have a large impact on human life. The electronic circuits in these devices require highly reliable operation. Radiographic testing has recently been in strong demand as a nondestructive way to help ensure high reliability. Companies that use high-density micrometer-scale circuits or lithium-ion batteries require high speed and high magnification inspection of all parts. The authors have developed a new X-ray source supporting these requirements. The X-ray source has a sealed tube with a transmissive target on a diamond window that offers advantages over X-ray sources having a sealed tube with a reflective target. The X-ray source provides high-power-density X-ray with no anode degradation and a longer shelf life. In this paper, the authors will summarize X-ray source classification relevant to electronic device inspection and will detail X-ray source performance requirements and challenges. The paper will also elaborate on technologies employed in the X-ray source including tube design implementations for high-power-density X-ray, high resolution, and high magnification simultaneously; reduced system downtime for automated X-ray inspection; and reduced dosages utilizing quick X-ray on-and-off emission control for protection of sensitive electronic devices.

High Power and High Reliability Vertical-Cavity Surface-Emitting Laser Array

2011 ◽  
Vol 38 (8) ◽  
pp. 0802011
Author(s):  
崔锦江 Cui Jinjiang ◽  
宁永强 Ning Yongqiang ◽  
姜琛昱 Jiang Chenyu ◽  
王帆 Wang Fan ◽  
施燕博 Shi Yanbo ◽  
...  
Keyword(s):  
High Power ◽  
High Reliability ◽  
Cavity Surface ◽  
Laser Array ◽  
Vertical Cavity Surface ◽  
Surface Emitting Laser ◽  
Vertical Cavity

Design and fabrication of 12 W high power and high reliability 915 nm semiconductor lasers

2018 ◽  
Vol 11 (4) ◽  
pp. 590-603
Author(s):  
仇伯仓 QIU Bo-cang ◽  
胡海 MARTIN Hai HU ◽  
汪卫敏 WANG Wei-min ◽  
刘文斌 LIU Wen-bin ◽  
白雪 BAI Xue
Keyword(s):  
Semiconductor Lasers ◽  
High Power ◽  
High Reliability
Sign in / Sign up

Export Citation Format

Share Document