Parallelization of finite volume computations for heat transfer application using unstructured mesh partitioning algorithms

2002 ◽  
Author(s):  
C. Singh Verma ◽  
V.C.V. Rao
Keyword(s):  
Heat Transfer ◽  
Finite Volume ◽  
Unstructured Mesh ◽  
Mesh Partitioning ◽  
Partitioning Algorithms

Combined Microstructure and Heat Transfer Modeling of Carbon Nanotube Thermal Interface Materials1

2016 ◽  
Vol 138 (4) ◽  
Author(s):  
Sridhar Sadasivam ◽  
Stephen L. Hodson ◽  
Matthew R. Maschmann ◽  
Timothy S. Fisher
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Finite Volume ◽  
Pressure Dependence ◽  
Matrix Material ◽  
Three Dimensional ◽  
Coarse Grain ◽  
Total Thermal Resistance ◽  
Thermal Interface ◽  
Cnt Arrays

A microstructure-sensitive thermomechanical simulation framework is developed to predict the mechanical and heat transfer properties of vertically aligned CNT (VACNT) arrays used as thermal interface materials (TIMs). The model addresses the gap between atomistic thermal transport simulations of individual CNTs (carbon nanotubes) and experimental measurements of thermal resistance of CNT arrays at mesoscopic length scales. Energy minimization is performed using a bead–spring coarse-grain model to obtain the microstructure of the CNT array as a function of the applied load. The microstructures obtained from the coarse-grain simulations are used as inputs to a finite volume solver that solves one-dimensional and three-dimensional Fourier heat conduction in the CNTs and filler matrix, respectively. Predictions from the finite volume solver are fitted to experimental data on the total thermal resistance of CNT arrays to obtain an individual CNT thermal conductivity of 12 W m−1 K−1 and CNT–substrate contact conductance of 7 × 107 W m−2 K−1. The results also indicate that the thermal resistance of the CNT array shows a weak dependence on the CNT–CNT contact resistance. Embedding the CNT array in wax is found to reduce the total thermal resistance of the array by almost 50%, and the pressure dependence of thermal resistance nearly vanishes when a matrix material is introduced. Detailed microstructural information such as the topology of CNT–substrate contacts and the pressure dependence of CNT–opposing substrate contact area are also reported.

Verification of Finite Volume Computations on Steady-State Fluid Flow and Heat Transfer

2001 ◽  
Vol 124 (1) ◽  
pp. 11-21 ◽  
Author(s):  
J. Cadafalch ◽  
C. D. Pe´rez-Segarra ◽  
R. Co`nsul ◽  
A. Oliva
Keyword(s):  
Heat Transfer ◽  
Fluid Flow ◽  
Steady State ◽  
Finite Volume ◽  
Numerical Solutions ◽  
Three Dimensional ◽  
Independent Solution ◽  
Post Processing ◽  
Square Duct ◽  
Flow And Heat Transfer

This work presents a post-processing tool for the verification of steady-state fluid flow and heat transfer finite volume computations. It is based both on the generalized Richardson extrapolation and the Grid Convergence Index GCI. The observed order of accuracy and a error band where the grid independent solution is expected to be contained are estimated. The results corresponding to the following two and three-dimensional steady-state simulations are post-processed: a flow inside a cavity with moving top wall, an axisymmetric turbulent flow through a compressor valve, a premixed methane/air laminar flat flame on a perforated burner, and the heat transfer from an isothermal cylinder enclosed by a square duct. Discussion is carried out about the certainty of the estimators obtained with the post-processing procedure. They have been shown to be useful parameters in order to assess credibility and quality to the reported numerical solutions.

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