IC fillet-lifting mechanism on wave soldering after reflow soldering

2006 ◽  
Author(s):  
G. Izuta ◽  
T. Tanabe ◽  
J. Murai ◽  
M. Murakami ◽  
K. Suganuma
Keyword(s):  
Reflow Soldering ◽  
Wave Soldering

scholarly journals Joining of Electrodes to Ultra-Thin Metallic Layers on Ceramic Substrates in Cryogenic Sensors

Sensors ◽  
2021 ◽  
Vol 21 (14) ◽  
pp. 4919
Author(s):  
Marcin Lebioda ◽  
Ryszard Pawlak ◽  
Jacek Rymaszewski
Keyword(s):  
Cryogenic Temperatures ◽  
Thermal And Mechanical Properties ◽  
Reflow Soldering ◽  
Ceramic Substrates ◽  
Temperature Range ◽  
Wave Soldering ◽  
Materials Used ◽  
Standard Designs ◽  
Electrical Connections ◽  
Method Show

Microjoining technologies are crucial for producing reliable electrical connections in modern microelectronic and optoelectronic devices, as well as for the assembly of electronic circuits, sensors, and batteries. However, the production of miniature sensors presents particular difficulties, due to their non-standard designs, unique functionality and applications in various environments. One of the main challenges relates to the fact that common methods such as reflow soldering or wave soldering cannot be applied to making joints to the materials used for the sensing layers (oxides, polymers, graphene, metallic layers) or to the thin metallic layers that act as contact pads. This problem applies especially to sensors designed to work at cryogenic temperatures. In this paper, we demonstrate a new method for the dynamic soldering of outer leads in the form of metallic strips made from thin metallic layers on ceramic substrates. These leads can be used as contact pads in sensors working in a wide temperature range. The joints produced using our method show excellent electrical, thermal, and mechanical properties in the temperature range of 15–300 K.

Critical Soldering Interconnect Technology in SMT

2015 ◽  
Vol 713-715 ◽  
pp. 3001-3006
Author(s):  
Xiao Ming Hu
Keyword(s):  
Contact Angle ◽  
Circuit Board ◽  
Reflow Soldering ◽  
Surface Mount ◽  
Printed Circuit ◽  
Wave Soldering ◽  
Product Manufacturing ◽  
Interconnect Technology ◽  
Through Hole

this paper introduced the important soldering interconnect technology in SMT. In electric product manufacturing process, sometime we must place components in through-hole ways , then we use wave soldering. Wave soldering is used for both through-hole printed circuit assemblies, and surface mount. As technology changing very soon, the through-hole components have been largely replaced by surface mount components, this time ,Reflow soldering is the most common method of attaching surface mount components to a circuit board,but not wave soldering also reflowing, we must focus on wetting , It quantifies the wettability of a solid surface by a liquid .wetting angle is a the important quantity (also called contact angle).it can judge the quality of solder joints.

Lead-free Solder Joints Strength for Wave Soldering after Reflow Soldering

2003 ◽  
Vol 2003 (0) ◽  
pp. 621-622
Author(s):  
Hiroyuki TAKAHASHI ◽  
Kenji HIROHATA ◽  
Katsumi HISANO ◽  
Takashi KAWAKAMI ◽  
Naoyuki OZAWA ◽  
...  
Keyword(s):  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Soldering ◽  
Wave Soldering ◽  
Free Solder

scholarly journals Yield Improvement in Wave Soldering Process by Using Customised Pallets

2021 ◽  
Vol 23 (06) ◽  
pp. 1001-1010
Author(s):  
Dr.Salil Dey ◽  
◽  
Mr. Prince Kumar ◽  
Keyword(s):  
Production Rate ◽  
Yield Improvement ◽  
Reflow Soldering ◽  
Soldering Process ◽  
Wave Soldering ◽  
Through Hole

Presently there are two types of components available in the Electronic Industries; they are 1. Surface-mounted Devices 2. Leaded components (through-hole components). Surface-mounted components can be assembled at first speed due to automation in the mounting and reflow soldering process. But the speed at which leaded components are mounted and soldered is not that fast. Hence there is always a challenge to match the production rate of PCB having led and surface mounted devices.

Signature Analysis of Package Delamination Using Scanning Acoustic Microscope

1996 ◽  
Author(s):  
S.X. Li ◽  
K. Lee ◽  
J. Hulog ◽  
R. Gannamani ◽  
S. Yin
Keyword(s):  
Failure Analysis ◽  
Early Stage ◽  
Signature Analysis ◽  
Acoustic Microscope ◽  
Reflow Soldering ◽  
Moisture Expansion ◽  
Scanning Acoustic Microscope ◽  
Package Reliability

Abstract Package delaminations are often associated with electrical and package reliability problems in IC devices. Delaminations caused by electrical-over-stress (EOS) and moisture expansion during reflow soldering have shown different delamination patterns. A Scanning Acoustic Microscope (SAM) can be used to detect package delaminations. Understanding these delamination signatures can help us quickly identify the failure cause at an early stage of the failure analysis.

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