Component interface description using HyperMSCs and connectors

2002 ◽  
Author(s):  
P. Graubmann ◽  
E. Rudolph ◽  
J. Grabowski
Keyword(s):  
Component Interface

scholarly journals Automated Test System for Test and Evaluation of C-Band Transmitter Packages for Geosat Spacecrafts

2019 ◽  
Vol 8 (2) ◽  
pp. 4591-4596
Keyword(s):  
Rapid Development ◽  
User Interaction ◽  
Test System ◽  
General Purpose ◽  
Virtual Instrumentation ◽  
Labview Software ◽  
Test And Evaluation ◽  
Automated Test System ◽  
Automated Test ◽  
Component Interface

The aim of this paper is to develop an Automated Test System (ATS) for the Test and Evaluation of C-Band Transmitter packages for GEOSAT Space crafts using Virtual Instrumentation. Efficiency, coverage, quality and accuracy for the test and evaluation of Device Under Test (DUT) can be increased by Automated Testing. Minimizing the errors anticipated with manual intervention. Automated Test System using Virtual instrumentation (VI) combines rapid development software and modular, flexible hardware to create user-defined test systems. Here Modular PXI (Peripheral component interface Extensions for Instrumentation) instruments from National Instruments are used with NI-LabVIEW software for realizing the ATS. For characterizing the C-Band Transmitter, Spectrum analyzer & Digital Multimeter (DMM) is configured in PXI form-factor and the Power supply is controlled through GPIB (General Purpose Interface Bus) bus. The complete software is developed using NI LabVIEW which takes care of configuring the test condition and analyzing the DUT performance. The user friendly GUI well takes care of user interaction to the ATS.

The Elucidation of Mechanism of Local Sound Pressure Increase Phenomenon

2004 ◽  
Author(s):  
Reiko Koganei ◽  
Shigemasa Ando ◽  
Qinzhong Shi ◽  
Ichiro Hagiwara
Keyword(s):  
Structural Damage ◽  
Sound Pressure ◽  
Pressure Increase ◽  
Narrow Gap ◽  
Local Pressure ◽  
Acoustic Environment ◽  
Space Instruments ◽  
Acoustic Cavity ◽  
Lift Off ◽  
Component Interface

Payloads of satellite are exposed on the severe acoustic environment at the process of lift-off and supersonic zone of a launcher. This acoustic environment excites the payload in high pressure and broad frequency band of random acoustical excitation, which may cause serious damage to the structures or instruments of the spacecraft inside. Space instruments are designed and verified to the acoustic environment by ground reverberant acoustic chamber in order to specify random vibration level at component interface and to verify the payloads are working in function and the structure does not have structural damage. The present load sound pressure specification assumes that the sound pressure interior fairing is uniformly distributed. In spacecraft system acoustic tests, local pressure increase occurs in the narrow gap between spacecraft primal structure and components facing toward the fairing wall. This acoustical environment load to the components differs from that the components were tested alone and the flight acoustic environment may not be actually simulated in the ground testing. It is important to clarify the mechanism of sound pressure increase in the narrow gap in order to predict the level of sound pressure increase. In this study, we focus to the investigation of the mechanism by basic experiment including acoustic testing and vibration modal survey. It is clarified that the main reason of the phenomenon is dominated by the acoustic cavity on the appropriate boundary condition rather than structure vibration. And more, we predict the frequency at which the sound pressure increase at the narrow gap and compare analysis results with experiment results by using Boundary Element Method (BEM).

Modular product design for additive manufacturing of satellite components: maximising product value using genetic algorithms

2019 ◽  
Vol 27 (4) ◽  
pp. 331-346 ◽  
Author(s):  
Olivia Borgue ◽  
Massimo Panarotto ◽  
Ola Isaksson
Keyword(s):  
Additive Manufacturing ◽  
Product Design ◽  
Design Concepts ◽  
Modular Product ◽  
Trade Offs ◽  
Function Modelling ◽  
Part Consolidation ◽  
Component Interface ◽  
Optimisation Algorithms

For space manufacturers, additive manufacturing promises to dramatically reduce weight and costs by means of integral designs achieved through part consolidation. However, integrated designs hinder the ability to change and service components over time – actually increasing costs – which is instead enabled by highly modular designs. Finding the optimal trade-off between integral and modular designs in additive manufacturing is of critical importance. In this article, a product modularisation methodology is proposed for supporting such trade-offs. The methodology is based on combining function modelling with optimisation algorithms. It evaluates product design concepts with respect to product adaptability, component interface costs, manufacturing costs and cost of post-processing activities. The developed product modularisation methodology is derived from data collected through a series of workshops with industrial practitioners from three different manufacturer companies of space products. The implementation of the methodology is demonstrated in a case study featuring the redesign of a satellite antenna.

Mechanical Bond Strength of the Cement–Tibial Component Interface in Total Knee Arthroplasty

2006 ◽  
Vol 21 (6) ◽  
pp. 883-888 ◽  
Author(s):  
Gavin T. Pittman ◽  
Christopher L. Peters ◽  
Jerod L. Hines ◽  
Kent N. Bachus
Keyword(s):  
Total Knee Arthroplasty ◽  
Bond Strength ◽  
Knee Arthroplasty ◽  
Tibial Component ◽  
Mechanical Bond ◽  
Total Knee ◽  
Component Interface

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

2013 ◽  
Author(s):  
Adam Pearl ◽  
Michael Osterman
Keyword(s):  
Failure Mode ◽  
Surface Finish ◽  
Electroless Nickel ◽  
Primary Role ◽  
Mechanical Shock ◽  
Printed Wiring Boards ◽  
Printed Wiring Board ◽  
Bga Packages ◽  
Immersion Silver ◽  
Component Interface

Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG), which has been used in component packaging, has been gaining attention as a surface finish for printed wiring boards. The primary role of a printed wiring board surface finish is to provide a solderable surface for assembly, creating a reliable solder interconnect. With regards to reliability, the increased use of mobile electronics has resulted in the need to consider the ability of interconnects to withstand repeated mechanical shocks. This paper examines the drop reliability of both SnPb and SAC305 interconnects formed on ENEPIG finished printed wiring boards. For comparison, the drop reliability test results for similar boards with Immersion Silver (ImAg) board finish are included. Test boards include BGA and resistor packages. The boards are dropped 500 times to achieve failure across the components. Failure analysis revealed that the dominant failure mode for BGA packages on the ENEPIG finish was cracking in the solder balls at the component interface, while for the ImAg finish the dominant failure mode was cratering in the board laminate below the solder pad. For the resistor packages, cracking through the solder joint at the component interface was the dominant failure mode for both the ENEPIG and ImAg finishes. The drop results indicate that both finishes are suitable for systems that could experience mechanical shock due to drop, with components soldered onto ENEPIG with a SAC 305 solder having the highest survivability. The combination of SnPb and ImAg was found to be superior to SAC 305 and ImAg.

A Theoretical and Experimental Analysis of the Sealing Capability of a Membrane Seal

2014 ◽  
Author(s):  
Stacie Tibos ◽  
Randhir Aujla ◽  
Przemyslaw Pyzik ◽  
Martin Lewis ◽  
Sascha Justl
Keyword(s):  
Gas Turbines ◽  
Surface Condition ◽  
Test Results ◽  
Actuation System ◽  
Thermal Growth ◽  
Precise Adjustment ◽  
Wide Range ◽  
Performance Curves ◽  
Secondary Air ◽  
Component Interface

Improvements in turbine performance are increasingly being driven by the need to control leakage both in the main gas path as well as secondary air flow systems. Membrane seals have long been established as a method of sealing in some of the harshest of environments found in gas turbines. The membrane seal has a wide usage in gas turbines for stationary component interface sealing. The geometry is of plate construction with bulbous ends, the seals are assembled vertically and are retained by the component grooves. The grooves allow relative sliding and rotation against their surfaces a necessary feature, since during operation the seal needs to withstand relative movements due to thermal growth, vibratory forces, excitation and assembly loads. However, more accurate leakage estimates are required. Thus, in order to evaluate the complete performance characteristics of the seal for a wide range of working conditions, a theoretical and experimental campaign was undertaken. The membrane seal performance curves were created based on a series of tests performed in a specially designed rig. The rig utilised an actuation system that allowed for the precise adjustment of the seal’s relative position in two directions while performing the tests at a given working condition. It was noted that not only the movement and deformation of the membrane but also, assembly clearances and surface condition of the components have an impact on the seal’s performance. To assist in the understanding of the influence of the changing parameters on the performance of the seal an FEA study was undertaken employing known data to aid the understanding and improve the knowledge of how the seal behaves under specific engine conditions. The evaluation gives confidence in the experimental test results.

A Software Integration Testing Architecture Based on Contract

2011 ◽  
Vol 474-476 ◽  
pp. 693-698
Author(s):  
Su Ping Yu ◽  
Wei Wei Mao
Keyword(s):  
Traditional Method ◽  
Integration Testing ◽  
Software Integration ◽  
Component Software ◽  
State Tracking ◽  
Component Interface

Under the guidance of DBC theory, a new architecture, called Integration Testing Architecture for Contract-Based System (ITACBS) is proposed in this paper. The ITACBS fully considers the characteristics of the component software, using the component interface of the contract document to describe the behavior of the system components.The aim of the ITACBS is to found the error between the components and the paste code and to achieve Integration Testing by monitoring and inspection contract. Compared with traditional method for packaging component,the method which used the ITACBS overcomes the non–state tracking of components caused by the unknown source.Test results show that the component wrapper can provide better testbility than other methods.

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