Study of Strain and Residual Stress Distribution in the Thickness Direction by Layer Removal Method and X-Ray Diffraction

2016 ◽  
Author(s):  
Tran Minh Tien ◽  
Nguyen Vinh Phoi ◽  
Le Chi Cuong ◽  
Luu Anh Tuyen ◽  
La Ly Nguyen
Keyword(s):  
Residual Stress ◽  
Stress Distribution ◽  
Residual Stress Distribution ◽  
Thickness Direction ◽  
X Ray Diffraction ◽  
X Ray ◽  
Removal Method ◽  
Layer Removal ◽  
Layer Removal Method

Measurement of Residual Stress Distribution of Ground Silicon Nitride by Glancing Incidence X-ray Diffraction Technique

1995 ◽  
Vol 39 ◽  
pp. 331-338
Author(s):  
Yoshihisa Sakaida ◽  
Keisuke Tanaka ◽  
Shintaro Harada
Keyword(s):  
Residual Stress ◽  
Surface Layer ◽  
Stress Distribution ◽  
Stress Measurement ◽  
Scintillation Counter ◽  
Ground Surface ◽  
Residual Stress Distribution ◽  
X Ray Diffraction ◽  
X Ray ◽  
Very High

A new method of X-ray stress measurement was proposed to estimate non-destructively the steep residual stress distribution in the surface layer of ground Si3N4. We assumed an exponential decrement of the residual stress near the ground surface, and derived a formula for the lattice strain as a function of sin2Ψ. In the experiments, the diffraction angles were measured on the ground surface for a widest possible range of sin2ѱ using an Ω-goniometer. In order to measure the diffraction angle at very high sin η values, a scintillation counter was located on the -η side and an incident X-ray beam impinged on the ground surface with a very low angle from the +η side using the glancing incidence X-ray diffraction technique. A strong non-linearity was found in the 20-sin2ѱ diagrams especially at very high ѱ -angles. From the analysis of non-linearity, the stress distribution in the surface layer was determined. Tine residual stress took the maximum compression of 2 GPa at a depth of about 0.5 μm from the surface, and then diminished to zero at about 25 μm in depth. In the close vicinity of the ground surface, the compressive residual stress was relieved because of both the surface roughness and microcracking induced during the grinding process.

Residual stress distribution as a function of depth in graphite/copper brazing joints via X-ray diffraction

2019 ◽  
Vol 35 (11) ◽  
pp. 2470-2476 ◽  
Author(s):  
Chun Li ◽  
Xiaoqing Si ◽  
Jian Cao ◽  
Junlei Qi ◽  
Zhibo Dong ◽  
...  
Keyword(s):  
Residual Stress ◽  
Stress Distribution ◽  
Residual Stress Distribution ◽  
X Ray Diffraction ◽  
X Ray
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