Flip-chip and bond wire/airbridge transitions between passive microwave transmission lines and laser diodes
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2020 ◽
Vol 92
(2)
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pp. 20502
1999 ◽
Vol 53
(6)
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pp. 35-45
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1989 ◽
Vol 32
(4)
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pp. 367-371
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2006 ◽
Vol 29
(3)
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pp. 409-414
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1996 ◽
pp. 45-80
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