Flow Behaviour of Anisotropic Conductive Adhesive Film during COG Bonding Process in Flat Panel Display Assembly

2006 ◽  
Author(s):  
Fabien Raugi ◽  
Mohammad Chowdhury ◽  
Helge Kristiansen ◽  
Johan Liu
Keyword(s):  
Bonding Process ◽  
Flow Behaviour ◽  
Conductive Adhesive ◽  
Flat Panel Display ◽  
Flat Panel ◽  
Adhesive Film ◽  
Anisotropic Conductive Adhesive

Issues in Assembly Process of Fine Pitch Chip-on-Flex Packages for LCD Applications

2004 ◽  
Author(s):  
Changsoo Jang ◽  
Seongyoung Han ◽  
Jay Ryu ◽  
Hangyu Kim
Keyword(s):  
Bonding Process ◽  
Conductive Adhesive ◽  
Assembly Process ◽  
Anisotropic Conductive Adhesive ◽  
Advantages And Disadvantages ◽  
Fine Pitch ◽  
Laser Bonding ◽  
Material Process ◽  
Process Combination ◽  
Underfill Material

Some of the current assembly issues of fine pitch chip-on-flex (COF) packages for LCD applications are reviewed. Traditional underfill material, anisotropic conductive adhesive (ACA) and non-conductive adhesive (NCA) are considered in conjunction with two applicable bonding methods including thermal and laser bonding. Advantages and disadvantages of each material/process combination are identified. Their applicability is further investigated to identify a process most suitable to the fine pitch packages (less than 40 μm). Numerical results and subsequent testing results indicate that NCA/laser bonding process produces most reliable joint for the fine pitch packages.

Process Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages

2001 ◽  
Vol 123 (4) ◽  
pp. 331-337 ◽  
Author(s):  
K. N. Chiang ◽  
C. W. Chang ◽  
C. T. Lin
Keyword(s):  
Tensile Stress ◽  
Process Modeling ◽  
Flip Chip ◽  
Thermal Loading ◽  
Conductive Adhesive ◽  
Adhesive Film ◽  
Anisotropic Conductive Adhesive ◽  
Fine Pitch ◽  
Assembly Technology ◽  
Conductive Particles

Development of flip-chip-on-glass (FCOG) assembly technology using anisotropic conductive adhesive/film (ACA/ACF) is currently underway to achieve fine pitch interconnections between driver IC and flat panel display. Conductive adhesives are characterized by fine-pitch capability and more environment compatibility. Anisotropic conductive adhesive/film (ACA/ACF) is composed of an adhesive resin and conductive particles, such as metallic or metal-coated polymer particles. In contrast to a solder type flip chip interconnection, the electric current passing through conductive particles becomes the dominant conduction paths. The interconnection between the particles and the conductive surfaces is constructed by the elastic/plastic deformation of conductive particles with contact pressure, which is maintained by tensile stress in the adhesive. Although loss of electric contact can occur when the adhesive expands or swells in the Z- axis direction, delamination and cracking can occur in the adhesive layer while the tensile stress is excessive. In addition to performing processing simulations as well as reliability modeling, this research investigates the contact force that is developed and relaxed within the interconnection during the process sequence by using nonlinear finite element simulations. Environmental effects, such as high temperature and thermal loading, are also discussed. Moreover, a parametric study is performed for process design. To improve performance and reliability, variables such as ACF materials, proper processing conditions are discussed as well. Furthermore, this study presents a novel method called equivalent spring method, capable of significantly reducing the analysis CPU time and make process modeling and contact analysis of the 3D ACA/ACF process possible.

Flip Chip Assembly Using Carbon Nanotube Bumps and Anisotropic Conductive Adhesive Film

2019 ◽  
Vol 27 (1) ◽  
pp. 825-830
Author(s):  
Xia Zhang ◽  
Teng Wang ◽  
Pär Berggren ◽  
Si Chen ◽  
Johan Liu
Keyword(s):  
Carbon Nanotube ◽  
Flip Chip ◽  
Conductive Adhesive ◽  
Adhesive Film ◽  
Anisotropic Conductive Adhesive ◽  
Flip Chip Assembly
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