Solderability of the Lead Free Surface Finishes

2006 ◽  
Author(s):  
Frantisek Steiner ◽  
Petr Harant
Keyword(s):  
Free Surface ◽  
Lead Free ◽  
Surface Finishes

Evaluation of two novel lead‐free surface finishes

2002 ◽  
Vol 14 (3) ◽  
pp. 19-24 ◽  
Author(s):  
Richard Ludwig ◽  
Ning‐Cheng Lee ◽  
Chonglun Fan ◽  
Yun Zhang
Keyword(s):  
Free Surface ◽  
Lead Free ◽  
Surface Finishes

Lead-Free Board Surface Finishes

2007 ◽  
pp. 221-269 ◽  
Author(s):  
Hugh Roberts ◽  
Kuldip Johal
Keyword(s):  
Lead Free ◽  
Surface Finishes ◽  
Board Surface

scholarly journals Finite element analysis of lead-free surface mount devices

2008 ◽  
Vol 43 (1) ◽  
pp. 212-220 ◽  
Author(s):  
Pradeep Hegde ◽  
Andrew R. Ochana ◽  
David. C. Whalley ◽  
Vadim. V. Silberschmidt
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Free Surface ◽  
Lead Free ◽  
Element Analysis ◽  
Surface Mount

Reliability Analysis of Lead-Free Solder Joints with Solder Doping on Harsh Environment

2016 ◽  
Vol 2016 (1) ◽  
pp. 000117-000122 ◽  
Author(s):  
Cong Zhao ◽  
Thomas Sanders ◽  
Zhou Hai ◽  
Chaobo Shen ◽  
John L. Evans
Keyword(s):  
Surface Finish ◽  
Isothermal Aging ◽  
Electroless Nickel ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Surface Mount ◽  
Surface Finishes ◽  
Free Solder ◽  
Immersion Silver

Abstract This paper investigates the effect of long term isothermal aging and thermal cycling on the reliability of lead-free solder mixes with different solder compositions, PCB surface finishes, and isothermal aging conditions. A variety of surface mount components are considered, including ball grid arrays (BGAs), quad flat no-lead packages (QFNs) and 2512 Surface Mount Resistors (SMRs). 12 lead-free solder pastes are tested; for BGA packages these are reflowed with lead-free solder spheres of SAC105, SAC305 and matched doped solder spheres (“matched” solder paste and sphere composition). Three surface finishes are tested: Organic Solderability Preservative (OSP), Immersion Silver (ImAg), and Electroless Nickel Immersion Gold (ENIG). All test components are subjected to isothermal aging at 125°C for 0 or 12 months, followed by accelerated thermal cycle testing from −40°C to 125°C. Data from the first 1500 cycles is presented here, with a focus on the effect of surface finish on package reliability. Current results demonstrate that the choice of surface finish has a strong effect on reliability. However, different solder materials appear to show different reliability trends with respect to the surface finishes, and the reliability trends of BGA and SMR packages also diverge.

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