Submerged liquid jet array impingement cooling with high gravity effects

2012 ◽  
Author(s):  
Z. Y. Wang ◽  
T. N. Wong ◽  
F. Duan ◽  
K. C. Toh ◽  
K. F. Choo ◽  
...  
Keyword(s):  
Liquid Jet ◽  
High Gravity ◽  
Impingement Cooling ◽  
Gravity Effects ◽  
Jet Array

Liquid Jet Impingement Cooling of a Rotating Disk

1986 ◽  
Vol 108 (3) ◽  
pp. 540-546 ◽  
Author(s):  
H. J. Carper ◽  
J. J. Saavedra ◽  
T. Suwanprateep
Keyword(s):  
Reynolds Number ◽  
Average Nusselt Number ◽  
Convective Heat Transfer Coefficient ◽  
Jet Impingement ◽  
Rotating Disk ◽  
Liquid Jet ◽  
Flow Rates ◽  
Impingement Cooling ◽  
Angular Velocities ◽  
Jet Nozzle

Results are presented from an experimental study conducted to determine the average convective heat transfer coefficient for the side of a rotating disk, with an approximately uniform surface temperature, cooled by a single liquid jet of oil impinging normal to the surface. Tests were conducted over a range of jet flow rates, jet temperatures, jet radial positions, and disk angular velocities with various combinations of three jet nozzle and disk diameters. Correlations are presented that relate the average Nusselt number to rotational Reynolds number, jet Reynolds number, jet Prandtl number, and dimensionless jet radial position.

Thermal Performance of Micro-Jet Impingement Device With Parallel Flow, Jet-Adjacent Fluid Removal

2018 ◽  
Author(s):  
Todd M. Bandhauer ◽  
David R. Hobby ◽  
Chris Jacobsen ◽  
Dave Sherrer
Keyword(s):  
Reynolds Number ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heated Surface ◽  
Jet Impingement ◽  
Impinging Jets ◽  
Thermal Interface Material ◽  
Cooling Device ◽  
Impingement Cooling ◽  
Jet Array

In a variety of electronic systems, cooling of various components imposes a significant challenge. A major aspect that inhibits the performance of many cooling solutions is the thermal resistance between the chip package and the cooling structure. Due to its low thermal conductivity, the thermal interface material (TIM) layer imposes a significant thermal resistance on the chip to cooling fluid thermal path. Advanced cooling methods that bypass the TIM have shown great potential in research and some specialty applications, yet have not been adopted widely by industry due to challenges associated with practical implementation and economic constraints. One advanced cooling method that can bypass the TIM is jet impingement. The impingement cooling device investigated in the current study is external to the integrated circuit (IC) package and could be easily retrofitted onto any existing microchip, similar to a standard heatsink. Jet impingement cooling has proven effective in previous studies. However, it has been shown that jet-to-jet interference severely degrades thermal performance of an impinging jet array. The present research addresses this challenge by utilizing a flow path geometry that allows for withdrawal of the impinging fluid immediately adjacent to each jet in the array. In this study, a jet impingement cooling solution for high-performance ICs was developed and tested. The cooling device was fabricated using modern advanced manufacturing techniques and consisted of an array of micro-scale impinging jets. A second array of fluid return paths was overlain across the jet array to allow for direct fluid extraction in the immediate vicinity of each jet, and fluid return passages were oriented in parallel to the impinging jets. The following key geometric parameters were utilized in the device: jet diameter (D = 300μm), distance from jet to impinging surface (H/D = 2.5), spacing between jets (S/D = 8), spacing between fluid returns (Sr/D = 8), diameter of fluid returns (Dr/D = 5). The device was mounted to a 2cm × 2cm uniformly heated surface which produced up to 165W and the resulting fluid-to-surface temperature difference was measured at a variety of flow rates. For this study, the device was tested using single-phase water. Jet Reynolds number ranged from 300–1500 and an average heat transfer coefficient of 13,100 W m−2 K−1 was achieved at a Reynolds number of only Red = 305.

Jet Impingement Cooling of an Inverter Module in the Harsh Environment of a Hybrid Vehicle

2005 ◽  
Author(s):  
Avijit Bhunia ◽  
Chung-Lung Chen
Keyword(s):  
Heat Dissipation ◽  
Jet Impingement ◽  
Base Plate ◽  
Hybrid Vehicle ◽  
System Level ◽  
Liquid Jet ◽  
Harsh Environment ◽  
Impingement Cooling ◽  
Dissipation Power ◽  
Cooling Technique

This paper presents a study of liquid jet impingement cooling technique and its system level implementation for thermal management of an inverter module in a hybrid vehicle. Clusters of anti-freeze liquid jet array impinge on the base plate of a 450V (DC Link voltage)/400A (RMS current) module, made by Semikron, Inc. In the harsh environment of an automobile, the ambient temperature of the coolant is 105°C, and the maximum allowable flow rate and pressure drop are 2.5GPM and 1.6bar respectively. The impingement cooling technique demonstrates 1623 Watts of heat dissipation for 20°C device temperature rise above ambient. This translates to a chip level dissipation power density of 56W/cm2, approximately 1.8X improvement over forced convection liquid cooling in the state-of-the-art pin fin cold plate. At the highest power, the less than 3°C temperature variation among the twelve IGBT measurements indicates a high degree of reliability in module operation. The efficient phase change heat transfer mechanism sets in at local base plate temperatures between 109–111°C, which accounts for more than 10% of the total heat dissipation at 1600W level.

Impact of Surface Micro-Structures on Liquid Micro-Jet Array Impingement Cooling: Comparison Between Single-Phase and Phase Change Heat Transfer

2011 ◽  
Author(s):  
Avijit Bhunia ◽  
Ya-Chi Chen ◽  
Chung-Lung Chen
Keyword(s):  
Heat Transfer ◽  
Phase Change ◽  
Single Phase ◽  
Nucleation Site ◽  
Impingement Cooling ◽  
Structured Surface ◽  
Impingement Heat Transfer ◽  
Plain Surface ◽  
Micro Structures ◽  
Jet Array

This article investigates liquid micro-jet array impingement cooling of a micro-structured surface. An array of 16 free-surface DI water jets, each 125 μm in diameter, and jet Reynolds number ranging between 816 and 2124, is used. A parametric study is carried out with micro-studs of varying size and spacing, implemented on a 1 cm2 base area surface. Based on the decades of research on heat transfer enhancement by surface modification, one would intuitively think that impingement cooling of a micro-structured surface will always be better than that of a plain surface. The current results are in contrary. The micro-structures actually degrade single-phase impingement heat transfer, compared to a plain surface. On the other hand, in the phase change regime they significantly enhance heat transfer, leading to a clear choice of optimal structure. The results are explained in the light of thin film dynamics, heat transfer surface area enhancement and nucleation site density.

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