Chip-package interaction: Challenges and solutions to mechanical stability of Back end of Line at 28nm node and beyond for advanced flip chip application

2012 ◽  
Author(s):  
F. Kuechenmeister ◽  
D. Breuer ◽  
H. Geisler ◽  
J. Paul ◽  
C. Shah ◽  
...  
Keyword(s):  
Flip Chip ◽  
Mechanical Stability

Packaging and Assembly Challenges for 2.5D/3D Devices

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001161-001191 ◽  
Author(s):  
Gerald Beyer ◽  
Kenneth Rebibis ◽  
Arnita Podpod ◽  
Francisco Cadacio ◽  
Teng Wang ◽  
...  
Keyword(s):  
Flip Chip ◽  
Mechanical Stability ◽  
Coefficient Of Thermal Expansion ◽  
Wafer Level ◽  
Large Area ◽  
Molding Process ◽  
Process Step ◽  
Joint Formation ◽  
Bonding Force ◽  
Underfill Material

The continuous development of 2.5D/3D packaging and stack assembly technologies has enabled different ways of producing advanced packages for the said devices. Advancement in D2D, D2W and W2W bonding have allowed these devices to be a step closer to being fully manufactured in volume. Thermo-compression bonding (TCB) process in combination with a pre-applied underfill material (WLUF/NUF) have been developed and investigated for assembling 2.5D and 3D devices with fine pitch (10μm - 40 μm) μbumps. This assembly step though developed, is not without challenges. There is a need to select the right underfill material based on its mechanical and chemical properties which could contribute to issues such as die warping, voiding and non-wetting of μbumps. These materials should also be able to withstand several thermal steps within the entire stack assembly process and is able to pass reliability testing. During the TCB process, bonding forces have a profound impact on the joint formation behavior on the μbumps. A low bonding force could produce a joint formation with a lot of underfill filler entrapment and an incomplete reaction of the solder. A higher bonding force leads to more solder squeezing-out, leaving a thin and completely reacted intermetallic compound (IMC) layer in the joints. The D2D, D2W and W2W assembled chips can then be packaged into a standard flip chip component using laminate BGA substrates. But even with this volume manufacturing process, the introduction of 2.5D/3D stack devices brings another set of challenges to an existing assembly infrastructure. Challenges such as the handling of the stacked devices, the CTE mismatches of an entirely new set of materials and the constant scaling in FC bump (Cu Pillar or C4) pitches in an existing infrastructure remain. The limitations of organic BGA packages in terms of CTE mismatches and costs gave rise to Fan-out Wafer Level Packages (FOWLP) or a technique also known as wafer reconstruction. However, there are certain tradeoffs particularly in the molding process step of fully D2W stacked or reconstructed 300 mm wafers. Molding such a large area of stacked chips with very narrow gaps of around 50μm to 300μm is a major challenge especially in trying to maintain the flatness of the wafer for succeeding wafer level processing steps. The large warpage of over molded (D2W or reconstructed) wafers is due to the coefficient of thermal expansion (CTE) mismatch between silicon and the reconstruction material. Therefore careful selection of materials and design of reconstructed structures is needed. Other techniques to keep the D2W or reconstructed assemblies are being developed and evaluated. Also by selecting an FOWLP or reconstructed wafer type of package, the integration of temporary bonding materials (TBMs) in TCB and wafer molding becomes a challenge. In order to produce the reconstructed wafer or the thinned D2W assembly, thermal and mechanical stability is required for such a material. In summary, the combination of advance stacking techniques and materials within certain 2.5D/3D integration flows could produce a low-cost and reliable 3D package. But these combinations will pose a number of challenges that needs to be addressed. This paper will discuss the different integration flows, stacking and packaging assembly techniques (and their challenges) that could make volume manufacturing possible for 2.5D/3D devices in the future.

An improved design for an Scanning Tunnelling Microscope (STM) for use in a Transmission Electron Microscope (TEM)

1991 ◽  
Vol 49 ◽  
pp. 384-385
Author(s):  
W.K. Lo ◽  
J.C.H. Spence
Keyword(s):  
Electron Microscope ◽  
Transmission Electron Microscope ◽  
Mechanical Stability ◽  
Scanning Tunnelling Microscope ◽  
Reflection Mode ◽  
Specimen Holder ◽  
Transmission Electron ◽  
Scanning Tunnelling ◽  
Improved Design

An improved design for a combination Scanning Tunnelling Microscope/TEM specimen holder is presented. It is based on earlier versions which have been used to test the usefulness of such a device. As with the earlier versions, this holder is meant to replace the standard double-tilt specimen holder of an unmodified Philips 400T TEM. It allows the sample to be imaged simultaneously by both the STM and the TEM when the TEM is operated in the reflection mode (see figure 1).The resolution of a STM is determined by its tip radii as well as its stability. This places strict limitations on the mechanical stability of the tip with respect to the sample. In this STM the piezoelectric tube scanner is rigidly mounted inside the endcap of the STM holder. The tip coarse approach to the sample (z-direction) is provided by an Inchworm which is located outside the TEM vacuum.

Experiments with a scanning tunneling microscope (STM) mounted in a scanning electron microscope (SEM)

1986 ◽  
Vol 44 ◽  
pp. 636-639
Author(s):  
Oliver C. Wells ◽  
Mark E. Welland
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Mechanical Stability ◽  
Tunneling Current ◽  
Feedback System ◽  
Scanning Tunneling ◽  
Surface Profiling ◽  
Close Proximity ◽  
Metal Tip ◽  
Scanning Electron

Scanning tunneling microscopes (STM) exist in two versions. In both of these, a pointed metal tip is scanned in close proximity to the specimen surface by means of three piezos. The distance of the tip from the sample is controlled by a feedback system to give a constant tunneling current between the tip and the sample. In the low-end STM, the system has a mechanical stability and a noise level to give a vertical resolution of between 0.1 nm and 1.0 nm. The atomic resolution STM can show individual atoms on the surface of the specimen.A low-end STM has been put into the specimen chamber of a scanning electron microscope (SEM). The first objective was to investigate technological problems such as surface profiling. The second objective was for exploratory studies. This second objective has already been achieved by showing that the STM can be used to study trapping sites in SiO2.

Electron microscopy of keratinocytes cultured on a collagen substrate used as an allograft for the treatment of chronic wounds

1992 ◽  
Vol 50 (2) ◽  
pp. 1104-1105
Author(s):  
Debby A. Jennings ◽  
Michael J. Morykwas ◽  
Louis C. Argenta
Keyword(s):  
Electron Microscopy ◽  
Cell Suspension ◽  
Single Cell ◽  
Chronic Wounds ◽  
Mechanical Stability ◽  
Uv Light ◽  
Type I ◽  
Single Cell Suspension ◽  
Collagen Substrate ◽  
Dermal Collagen

Grafts of cultured allogenic or autogenic keratlnocytes have proven to be an effective treatment of chronic wounds and burns. This study utilized a collagen substrate for keratinocyte and fibroblast attachment. The substrate provided mechanical stability and augmented graft manipulation onto the wound bed. Graft integrity was confirmed by light and transmission electron microscopy.Bovine Type I dermal collagen sheets (100 μm thick) were crosslinked with 254 nm UV light (13.5 Joules/cm2) to improve mechanical properties and reduce degradation. A single cell suspension of third passage neonatal foreskin fibroblasts were plated onto the collagen. Five days later, a single cell suspension of first passage neonatal foreskin keratinocytes were plated on the opposite side of the collagen. The grafts were cultured for one month.The grafts were fixed in phosphate buffered 4% formaldehyde/1% glutaraldehyde for 24 hours. Graft pieces were then washed in 0.13 M phosphate buffer, post-fixed in 1% osmium tetroxide, dehydrated, and embedded in Polybed 812.

P20 phosphor on polyimide as a large area high-resolution transmission screen for slow scan CCD systems

1995 ◽  
Vol 53 ◽  
pp. 20-21
Author(s):  
C. C. Ahn ◽  
S. Karnes ◽  
M. Lvovsky ◽  
C. M. Garland ◽  
H. A. Atwater ◽  
...  
Keyword(s):  
Mechanical Stability ◽  
High Energy ◽  
Practical Implementation ◽  
Line Pair ◽  
Modulation Transfer ◽  
Large Area ◽  
Ccd Imaging ◽  
Transmission Electron ◽  
The One ◽  
Beam Broadening

The bane of CCD imaging systems for transmission electron microscopy at intermediate and high voltages has been their relatively poor modulation transfer function (MTF), or line pair resolution. The problem originates primarily with the phosphor screen. On the one hand, screens should be thick so that as many incident electrons as possible are converted to photons, yielding a high detective quantum efficiency(DQE). The MTF diminishes as a function of scintillator thickness however, and to some extent as a function of fluorescence within the scintillator substrates. Fan has noted that the use of a thin layer of phosphor beneath a self supporting 2μ, thick Al substrate might provide the most appropriate compromise for high DQE and MTF in transmission electron microcscopes which operate at higher voltages. Monte Carlo simulations of high energy electron trajectories reveal that only little beam broadening occurs within this thickness of Al film. Consequently, the MTF is limited predominantly by broadening within the thin phosphor underlayer. There are difficulties however, in the practical implementation of this design, associated mostly with the mechanical stability of the Al support film.

A conduction-cooled stage for high-resolution Cryo-SEM

1992 ◽  
Vol 50 (2) ◽  
pp. 1282-1283
Author(s):  
John G. Sheehan
Keyword(s):  
High Resolution ◽  
Liquid Nitrogen ◽  
Mechanical Stability ◽  
Cooling System ◽  
Cold Trap ◽  
Nitrogen Gas ◽  
Particulate Suspensions ◽  
Advantages And Disadvantages ◽  
Convection Cooling ◽  
Styrene Butadiene

The goal is to examine with high resolution cryo-SEM aqueous particulate suspensions used in coatings for printable paper. A metal-coating chamber for cryo-preparation of such suspensions was described previously. Here, a new conduction-cooling system for the stage and cold-trap in an SEM specimen chamber is described. Its advantages and disadvantages are compared to a convection-cooling system made by Hexland (model CT1000A) and its mechanical stability is demonstrated by examining a sample of styrene-butadiene latex.In recent high resolution cryo-SEM, some stages are cooled by conduction, others by convection. In the latter, heat is convected from the specimen stage by cold nitrogen gas from a liquid-nitrogen cooled evaporative heat exchanger. The advantage is the fast cooling: the Hexland CT1000A cools the stage from ambient temperature to 88 K in about 20 min. However it consumes huge amounts of liquid-nitrogen and nitrogen gas: about 1 ℓ/h of liquid-nitrogen and 400 gm/h of nitrogen gas. Its liquid-nitrogen vessel must be re-filled at least every 40 min.

Analysis of Characteristics of Halogen and LED Automobile Lamps

2020 ◽  
pp. 57-62
Author(s):  
Olga Yu. Kovalenko ◽  
Yulia A. Zhuravlyova
Keyword(s):  
Power Consumption ◽  
Flip Chip ◽  
Weather Conditions ◽  
Luminous Flux ◽  
Luminous Efficacy ◽  
Colour Temperature ◽  
Study Results ◽  
Calculation Results ◽  
Mandatory Rules ◽  
Halogen Lamps

This work contains analysis of characteristics of automobile lamps by Philips, KOITO, ETI flip chip LEDs, Osram, General Electric (GE), Gtinthebox, OSLAMPledbulbs with H1, H4, H7, H11 caps: luminous flux, luminous efficacy, correlated colour temperature. Characteristics of the studied samples are analysed before the operation of the lamps. The analysis of the calculation results allows us to make a conclusion that the values of correlated colour temperature of halogen lamps are close to the parameters declared by manufacturers. The analysis of the study results has shown that, based on actual values of correlated colour temperature, it is not advisable to use LED lamps in unfavourable weather conditions (such as rain, fog, snow). The results of the study demonstrate that there is a slight dispersion of actual values of luminous flux of halogen lamps by different manufacturers. Maximum variation between values of luminous flux of different lamps does not exceed 14 %. The analysis of the measurement results has shown that actual values of luminous flux of all halogen lamps comply with the mandatory rules specified in the UN/ECE Regulation No. 37 and luminous flux of LED lamps exceeds maximum allowable value by more than 8 %. Luminous efficacy of LED lamps is higher than that of halogen lamps: more than 82 lm/W and lower power consumption. The results of the measurements have shown that power consumption of a LED automobile lamp is lower than that of similar halogen lamps by 3 times and their luminous efficacy is higher by 5 times.

SiO2 Entrapment of Animal Cells for Hybrid Bioartificial Organs

2000 ◽  
Vol 628 ◽  
Author(s):  
Giovanni Carturan ◽  
Renzo Dal Monte ◽  
Maurizio Muraca
Keyword(s):  
Gas Phase ◽  
Mechanical Stability ◽  
Porous Silica ◽  
Collagen Matrix ◽  
Homogeneous Layer ◽  
Animal Cells ◽  
Bioartificial Organs ◽  
Liver And Pancreas ◽  
Encapsulation Method ◽  
Metabolic Activities

ABSTRACTSi-alkoxides in gas phase are reactive towards the surface of animal cells, depositing a homogeneous layer of porous silica. This encapsulation method preserves cell viability and does not alter the hindrance of the biological load.In the prospective use for the design of a hybrid bioartificial liver, hepatocytes in a collagen matrix can be entrapped by the siliceous deposit which provides definite mechanical stability to the collagen matrix and molecular cutoff vs. high molecular weight proteins, including immunoglobulins. The functionality of the encapsulated cell load is maintained for the expressions of typical liver and pancreas metabolic activities.

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