Center Gate Molding challenges and improvements for cavity down TBGA packages

2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) ◽

10.1109/eptc.2012.6507040 ◽

2012 ◽

Author(s):

K. Muniandy ◽

S. T. S. Hian ◽

Teng Seng Kiong

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