Development for VCI (Vertical Circuit Interconnection) technology for stacked die package

2011 IEEE 13th Electronics Packaging Technology Conference ◽

10.1109/eptc.2011.6184440 ◽

2011 ◽

Cited By ~ 2

Author(s):

Ivan Chang ◽

Jensen Tsai ◽

James Chiang ◽

Daniel Liu ◽

FL Tsai ◽

...

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