Unique new packaging of semiconductor packaging technology high performation by encapsulation epoxy resin and VPES (vacuum printing encapsulation systems)

2003 ◽  
Author(s):  
A. Okuno
Keyword(s):  
Epoxy Resin ◽  
Packaging Technology ◽  
Semiconductor Packaging

FOWLP Technology eWLB – Enabler for Packaging of IoT/IoE Modules

2015 ◽  
Vol 2015 (1) ◽  
pp. 000239-000244 ◽  
Author(s):  
Steffen Kroehnert ◽  
José Campos ◽  
André Cardoso ◽  
Eoin O'Toole ◽  
Abel Janeiro ◽  
...  
Keyword(s):  
Internet Of Things ◽  
System Integration ◽  
Good News ◽  
The Internet ◽  
Smart System ◽  
Packaging Technology ◽  
Internet Of Everything ◽  
The Cost ◽  
Semiconductor Packaging ◽  
The Internet Of Things

The next big wave, the Internet of Things or Internet of Everything (IoT/IoE) is on the way. What does that mean for semiconductor packaging, assembly and test? What are the requirements? What solutions can be provided? The market will be wide and fragmented. Many different solutions will be needed. Flexibility and the capability to customize system solutions will be crucial. The fact is, it will be all about smart system integration, integration of sensors, MEMS, connectivity and memory: more functionality on less space in small and thin System-in-Package (SiP) and Package-on-Package (PoP). There will not be one specific packaging technology for IoT/IoE, and no new “IoT/IoE Packaging Technology”. The toolbox is here already, and further features required to meet the needs of future IoT/IoE modules are under development. That is actually good news, as the cost pressure will be high, and materialization of existing manufacturing environment, of mature and yielding packaging technologies will be a key for success.

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