Mirrored power distribution network noise injection for soft failure root cause analysis

2016 ◽  
Author(s):  
Suyu Yang ◽  
Benjamin Orr ◽  
David Pommerenke ◽  
Hideki Shumiya ◽  
Junji Maeshima ◽  
...  
Keyword(s):  
Power Distribution ◽  
Distribution Network ◽  
Root Cause Analysis ◽  
Power Distribution Network ◽  
Cause Analysis ◽  
Root Cause ◽  
Soft Failure ◽  
Noise Injection

The Role of Root Cause Analysis (RCA) in Power Distribution Network Interruption Reduction

2022 ◽  
pp. 241-265
Author(s):  
Saeed Ramezani ◽  
Mehdi Pirpiran ◽  
Mohamad Reza Behmaneshfar
Keyword(s):  
Power Supply ◽  
Power Distribution ◽  
Power Distribution Network ◽  
Supply Networks ◽  
Cause Analysis ◽  
Medium Voltage ◽  
Root Cause ◽  
Network Problems ◽  
Second Category

Responsibility and reliability are very important for electricity subscribers. Due to their extent, these networks face a variety of challenges, and most of them are recurring but can be prevented if the root causes are identified. One of the methods to identify the root of network problems is to use the RCA method in the analysis of blackouts. RCA is an approach that systematically investigates adverse events and, by gathering evidence and documentation, finds its root causes and offers solutions to address them. Finally, it monitors the implementation of solutions and evaluates their effectiveness. In this chapter, while introducing some of the challenges of medium voltage power supply networks, the root of the problems are extracted, and corrective solutions are presented in three sample problematic feeders. After extracting the solutions, they are divided into two categories: the first category is the solutions specific to the sample feeder, and the second category is the solutions that can be generalized to other parts of the power supply network.

Root Cause analysis of SG tube ODSCC indications within the tube sheets of NPP biblis unit A

2011 ◽  
pp. 78-86
Author(s):  
R. Kilian ◽  
J. Beck ◽  
H. Lang ◽  
V. Schneider ◽  
T. Schönherr ◽  
...  
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Rule Construction and its Execution for Root Cause Analysis

2012 ◽  
Vol 132 (10) ◽  
pp. 1689-1697
Author(s):  
Yutaka Kudo ◽  
Tomohiro Morimura ◽  
Kiminori Sugauchi ◽  
Tetsuya Masuishi ◽  
Norihisa Komoda
Keyword(s):  
Root Cause Analysis ◽  
Cause Analysis ◽  
Root Cause

Root Cause Analysis Techniques Using Picosecond Time Resolved LADA

2014 ◽  
Author(s):  
Dan Bodoh ◽  
Kent Erington ◽  
Kris Dickson ◽  
George Lange ◽  
Carey Wu ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Picosecond Laser ◽  
Root Cause Analysis ◽  
Fault Isolation ◽  
Time Resolved ◽  
Cause Analysis ◽  
Root Cause ◽  
Design And Manufacturing ◽  
Multiple Interactions ◽  
Established Technique

Abstract Laser-assisted device alteration (LADA) is an established technique used to identify critical speed paths in integrated circuits. LADA can reveal the physical location of a speed path, but not the timing of the speed path. This paper describes the root cause analysis benefits of 1064nm time resolved LADA (TR-LADA) with a picosecond laser. It shows several examples of how picosecond TR-LADA has complemented the existing fault isolation toolset and has allowed for quicker resolution of design and manufacturing issues. The paper explains how TR-LADA increases the LADA localization resolution by eliminating the well interaction, provides the timing of the event detected by LADA, indicates the propagation direction of the critical signals detected by LADA, allows the analyst to infer the logic values of the critical signals, and separates multiple interactions occurring at the same site for better understanding of the critical signals.

Root Cause Analysis for Pin Leakage

2016 ◽  
Author(s):  
Zhigang Song ◽  
Jochonia Nxumalo ◽  
Manuel Villalobos ◽  
Sweta Pendyala
Keyword(s):  
Failure Analysis ◽  
Root Cause Analysis ◽  
Advanced Technology ◽  
Process Step ◽  
Cause Analysis ◽  
Hard Mask ◽  
Technology Node ◽  
Root Cause ◽  
Tools And Techniques

Abstract Pin leakage continues to be on the list of top yield detractors for microelectronics devices. It is simply manifested as elevated current with one pin or several pins during pin continuity test. Although many techniques are capable to globally localize the fault of pin leakage, root cause analysis and identification for it are still very challenging with today’s advanced failure analysis tools and techniques. It is because pin leakage can be caused by any type of defect, at any layer in the device and at any process step. This paper presents a case study to demonstrate how to combine multiple techniques to accurately identify the root cause of a pin leakage issue for a device manufactured using advanced technology node. The root cause was identified as under-etch issue during P+ implantation hard mask opening for ESD protection diode, causing P+ implantation missing, which was responsible for the nearly ohmic type pin leakage.

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