Using Micro-electroforming and Micro-assembly Technology to Fabricate Vertical Probe Card

2006 ◽  
Author(s):  
Jung-Tang Huang ◽  
Kou-Yu Lee ◽  
Chan-Shoue Wu ◽  
Chung-Yi Lin ◽  
Sheng-Hsiung Shih
Keyword(s):  
Micro Assembly ◽  
Assembly Technology ◽  
Probe Card ◽  
Vertical Probe

Manipulation Mechanisms for Micro-Assembly Technology

2005 ◽  
Vol 502 ◽  
pp. 327-334
Author(s):  
Kunio Takahashi
Keyword(s):  
Adhesion Force ◽  
Force Measurement ◽  
Continuum Approximation ◽  
Theoretical Understanding ◽  
Elastic Continuum ◽  
Micro Assembly ◽  
Capillary Method ◽  
Interfacial Energies ◽  
Assembly Technology ◽  
Basic Approaches

Author has been working about mechanisms of some manipulation methods for micro-assembly, i.e., a mechanical method, an electro-adhesive method, and a capillary method. For the purpose of optimization and breakthrough of the micro-assembly technology, theoretical understanding of adhesion phenomenon is essential, because the adhesional force is proportional to the size of objects meanwhile gravitational force is proportional to the third power of it. Consequently the adhesion phenomenon is no more negligible for the smaller objects usually less than 1 mm, e.g., micro-objects. Author will introduce our analyses about the manipulation mechanisms and related basic approaches to the adhesion phenomena including an adhesion force measurement in Auger electron spectroscope, an elastic continuum approximation approach using contact mechanics, a quantum mechanics approach for surface energy, a molecular mechanics approach for surface and interfacial energies. Also it will be expressed that our data base project for the surface and interfacial energies is based on these basic approaches for the purpose of optimization and/or breakthrough of the micro-assembly technology.

Micro Assembly Technology and System

2008 ◽  
pp. 367-384
Author(s):  
R. Du ◽  
Candy X. Y. Tang ◽  
D. L. Zhang
Keyword(s):  
Micro Assembly ◽  
Assembly Technology

Joint Design and Fabrication for Mechanical Elastic Self-deformation Micro-Assembly Technology

2006 ◽  
Vol 505-507 ◽  
pp. 829-834
Author(s):  
Chia Lung Kuo ◽  
Jing Dae Huang
Keyword(s):  
Tungsten Carbide ◽  
The Self ◽  
Micro Edm ◽  
Micro Machining ◽  
Micro Fabrication ◽  
Machining Mechanism ◽  
Micro Assembly ◽  
Whole Process ◽  
Machining Center ◽  
Assembly Technology

A microstructure assembled into another part using the mechanical elastic self-deformation assembly technology is proposed in the paper. To attain the self-deformation during assembling, the assembly joint on the microstructure is analytically designed as the feature with an appropriate taper and cross clearance. Take account of the accuracy, the whole process from micro-fabrication to micro-assembly is carefully planned and practiced under a micro-EDM machining center system which consists of vertical micro-EDM with dividing mechanism, and horizontal micro-machining mechanism, which is referred to as on-process micro-assembly. To illustrate the micro-assembly strategies and procedures, a micro-rotor production including assemble a tungsten carbide four-phase micro-rotor into an alumina base has been provided and discussed.

Fabrication of a Silicon Micro-Probe for Vertical Probe Card Application

1998 ◽  
Vol 37 (Part 1, No. 12B) ◽  
pp. 7070-7073 ◽  
Author(s):  
Yong-Dae Kim ◽  
Jun-Hwan Sim ◽  
Jae-Woo Nam ◽  
Jong-Hyun Lee
Keyword(s):  
Probe Card ◽  
Vertical Probe

The Key Techniques on Micro-Assembly of Micro-Radio Modules

2012 ◽  
Vol 229-231 ◽  
pp. 1539-1542
Author(s):  
Wei Li ◽  
Jie Wang
Keyword(s):  
High Performance ◽  
Processing Technologies ◽  
Micro Assembly ◽  
Important Processing ◽  
Assembly Technology ◽  
Key Techniques ◽  
Micro Radio

Micro-assembly technology is one of important processing technologies to realize electronic equipments miniature and light with high performance and reliability. The key techniques in micro-assembly of micro-radio modules were discussed in this paper with analysis of their characteristics. Some suggestions in application of micro-assembly were pointed out in the end of this text.

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