Residual Stress Distribution in Stacked LSI Chips Mounted by Flip Chip Technology

2006 ◽  
Author(s):  
Nobuki Ueta ◽  
Hideo Miura
Keyword(s):  
Residual Stress ◽  
Stress Distribution ◽  
Flip Chip ◽  
Residual Stress Distribution ◽  
Chip Technology

Dominant Structural Factors of Local Residual Stress in Three-Dimensionally Stacked LSI Chips Mounted Using Flip Chip Technology

2007 ◽  
Author(s):  
Nobuki Ueta ◽  
Hideo Miura
Keyword(s):  
Residual Stress ◽  
Stress Distribution ◽  
Flip Chip ◽  
Stress And Strain ◽  
Structural Factors ◽  
Chip Technology ◽  
Average Residual ◽  
Reliable Performance ◽  
Stress Sensing ◽  
Periodic Stress

Since mechanical stress and strain change both electronic functions and reliability of LSI chips, it has become strongly important to control the residual stress and strain in them to assure their reliable performance. In this study, the authors discuss the stress distribution in chips stacked using area-arrayed metallic bumps. The average residual stress in the stacked two chips changes drastically depending on the distance from a bending neutral axis of the stacked structure, and the local residual stress also varies depending on the relative position of bumps between an upper and a bottom interconnection layer. However, the residual stress of the top chip with a free surface is not affected by the bump alignment in lower interconnection layers. It is very important, therefore, to optimize the thickness of a chip and other structural factors as mentioned above to control not only the average residual stress but also the amplitude of the periodic stress. Finally, the estimated stress distribution in the stacked two chips was proved in detail by the experiment using stress-sensing chips with 2μm long strain gauges consisted of single-crystalline Si.

Influence of the Welded Joint on the Mechanical Behavior of Steel Piles during Static and Dynamic Deformation

2007 ◽  
Vol 345-346 ◽  
pp. 1469-1472
Author(s):  
Gab Chul Jang ◽  
Kyong Ho Chang ◽  
Chin Hyung Lee
Keyword(s):  
Residual Stress ◽  
Stress Distribution ◽  
Mechanical Behavior ◽  
Welded Joint ◽  
Dynamic Deformation ◽  
Three Dimensional ◽  
Steel Structures ◽  
Residual Stress Distribution ◽  
Dynamic Mechanical Behavior ◽  
Steel Piles

During manufacturing the welded joint of steel structures, residual stress is produced and weld metal is used inevitably. And residual stress and weld metal influence on the static and dynamic mechanical behavior of steel structures. Therefore, to predict the mechanical behavior of steel pile with a welded joint during static and dynamic deformation, the research on the influence of the welded joints on the static and dynamic behavior of steel pile is clarified. In this paper, the residual stress distribution in a welded joint of steel piles was investigated by using three-dimensional welding analysis. The static and dynamic mechanical behavior of steel piles with a welded joint is investigated by three-dimensional elastic-plastic finite element analysis using a proposed dynamic hysteresis model. Numerical analyses of the steel pile with a welded joint were compared to that without a welded joint with respect to load carrying capacity and residual stress distribution. The influence of the welded joint on the mechanical behavior of steel piles during static and dynamic deformation was clarified by comparing analytical results

scholarly journals A study on the optimization of residual stress distribution in the polyethylene and polyketone double layer pipes

2021 ◽  
pp. 101547
Author(s):  
A.G. Ramu ◽  
Sunwoo Kim ◽  
Heungwoo Jeon ◽  
Amal M. Al-Mohaimeed ◽  
Wedad A. Al-onazi ◽  
...  
Keyword(s):  
Residual Stress ◽  
Stress Distribution ◽  
Double Layer ◽  
Residual Stress Distribution

scholarly journals Concept for controlled adjustment of residual stress states in semi-finished products by gradation extrusion

2021 ◽  
Author(s):  
René Selbmann ◽  
Markus Baumann ◽  
Mateus Dobecki ◽  
Markus Bergmann ◽  
Verena Kräusel ◽  
...  
Keyword(s):  
Residual Stress ◽  
Stress Distribution ◽  
Experimental Tests ◽  
Residual Stress Distribution ◽  
Forming Process ◽  
Compressive Stresses ◽  
Energy Consuming ◽  
Stress States ◽  
Set Up ◽  
Time And Energy

AbstractThe residual stress distribution in extruded components and wires after a conventional forming process is frequently unfavourable for subsequent processes, such as bending operations. High tensile residual stresses typically occur near the surface of the wire and thus limit further processability of the material. Additional heat treatment operations or shot peening are often inserted to influence the residual stress distribution in the material after conventional manufacturing. This is time and energy consuming. The research presented in this paper contains an approach to influence the residual stress distribution by modifying the forming process for wire-like applications. The aim of this process is to lower the resulting tensile stress levels near the surface or even to generate compressive stresses. To achieve these residual compressive stresses, special forming elements are integrated in the dies. These modifications in the forming zone have a significant influence on process properties, such as degree of deformation and deformation direction, but typically have no influence on the diameter of the product geometry. In the present paper, the theoretical approach is described, as well as the model set-up, the FE-simulation and the results of the experimental tests. The characterization of the residual stress states in the specimen was carried out by X-ray diffraction using the sin2Ψ method.

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