Gold thin film viscoelastic losses of a length extension mode resonator

Author(s):  
Beatrice Bourgeteau-Verlhac ◽  
Raphael Levy ◽  
Thomas Perrier ◽  
Pierre Lavenus ◽  
Jean Guerard ◽  
...  
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.


2021 ◽  
Vol 1098 (6) ◽  
pp. 062062
Author(s):  
R Fahdiran ◽  
I Sugihartono ◽  
E Handoko ◽  
E Budi ◽  
A B Susila ◽  
...  

2004 ◽  
Vol 43 (No. 8B) ◽  
pp. L1078-L1080
Author(s):  
Ilsin An ◽  
Deokkyeong Seong ◽  
Hyekeun Oh
Keyword(s):  

2002 ◽  
Vol 80 (10) ◽  
pp. 1716-1718 ◽  
Author(s):  
Eric Irissou ◽  
Boris Le Drogoff ◽  
Mohamed Chaker ◽  
Daniel Guay

2013 ◽  
Vol 03 (02) ◽  
pp. 281-283 ◽  
Author(s):  
Dong-pei Qian ◽  
Chuan-gui Wu ◽  
Yao Shuai ◽  
Wen-bo Luo ◽  
Qiang-xiang Peng ◽  
...  

2016 ◽  
Vol 122 (4) ◽  
Author(s):  
Minh Thanh Do ◽  
Quang Cong Tong ◽  
Alexander Lidiak ◽  
Mai Hoang Luong ◽  
Isabelle Ledoux-Rak ◽  
...  

2005 ◽  
Vol 875 ◽  
Author(s):  
P. Goudeau ◽  
N. Tamura ◽  
G. Parry ◽  
J. Colin ◽  
C. Coupeau ◽  
...  

AbstractStress/Strain fields associated with thin film buckling induced by compressive stresses or blistering due to the presence of gas bubbles underneath single crystal surfaces are difficult to measure owing to the microscale dimensions of these structures. In this work, we show that micro Scanning X-ray diffraction is a well suited technique for mapping the strain/stress tensor of these damaged structures.


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