A Methodology for distributed Co-design and Coextraction of Die Re-distribution Layer and Package

2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) ◽

10.1109/edaps.2018.8680894 ◽

2018 ◽

Author(s):

Ashish Gupta ◽

Abhishek Bhattacharya ◽

Vansh Mohan ◽

Ayush Singh ◽

Ritabrata Bhattacharya ◽

...

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