Thermal-mechanical analysis of packaged power amplifiers based on heterogeneous integrations using photosensitive BCB
2012 ◽
Vol 48
(6)
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pp. 2240-2248
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Keyword(s):
2000 ◽
2018 ◽
Vol 332
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pp. 297-306
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2009 ◽
pp. 84-84-16
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