Neural network techniques for fast parametric modeling of vias on multilayered circuit packages
2020 ◽
Vol 33
(6)
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Keyword(s):
2017 ◽
Vol 65
(3)
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pp. 729-745
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2009 ◽
Vol 09
(04)
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pp. 507-525
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2013 ◽
Vol 61
(5)
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pp. 1733-1747
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