Growth kinetics of intermetallic compound layers at the interface during laser-assisted bonding depending on surface finish

2020 ◽  
Author(s):  
Hong-Sub Joo ◽  
Kyung Deuk Min ◽  
Choong-Jae Lee ◽  
Byeong Uk Hwang ◽  
Seung-Boo Jung
Keyword(s):  
Intermetallic Compound ◽  
Growth Kinetics ◽  
Surface Finish ◽  
Kinetics Of

scholarly journals Growth kinetics of antiphase domain in Ti3Al intermetallic compound

2004 ◽  
Vol 5 (1-2) ◽  
pp. 19-28 ◽  
Author(s):  
Y. Koizumi ◽  
H. Katsumura ◽  
Y. Minamino ◽  
N. Tsuji ◽  
J.G. Lee ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Growth Kinetics ◽  
Antiphase Domain ◽  
Kinetics Of

Morphological Effect on the Intermetallic Compound Layer Growth Kinetics of Metallurgical Joining

2020 ◽  
Vol 307 ◽  
pp. 26-30
Author(s):  
Azman Jalar ◽  
Maria Abu Bakar ◽  
Mohd. Zulhakimi Ab. Razak ◽  
Norliza Ismail
Keyword(s):  
Intermetallic Compound ◽  
Growth Kinetics ◽  
Intermetallic Layer ◽  
Compound Layer ◽  
Effect Of Temperature ◽  
Growth Exponent ◽  
Intermetallic Compound Layer ◽  
Growth Behaviour ◽  
Morphological Effect ◽  
Kinetics Of

Evaluating the growth kinetics is one of the most important characteristic in assessing the quality and reliability of metallurgical joining, especially in electronics packaging such as soldering and wire bonding technology. The growth kinetics is normally assessed using Arrhenius equation that involves diffusion activities due to thermally activated process. The well-known factors of thermal and time together with generally accepted growth exponent have been widely used for this assessment. The intermetallic compound layer which is the by-product of metallurgical reaction during soldering process has been exposed to high temperature to accelerate its growth. The cross-section of the joining was observed using optical microscope to quantify the layer of intermetallic compound. Morphological effect and shape factor of the layer have been analysed in complement with the effect of temperature and time on the growth behaviour. Directional growth and irregularities shape of the intermetallic layer show some inconsistency on the selection of growth exponent. The effect of initial size of intermetallic layer must also be considered in this assessment. This study suggests that the morphological effect must be analysed prior to the selection the growth exponent in assessing growth behaviour and kinetics of intermetallic layer in metallurgical joining.

Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers

2009 ◽  
Vol 49 (3) ◽  
pp. 242-247 ◽  
Author(s):  
T. Laurila ◽  
J. Hurtig ◽  
V. Vuorinen ◽  
J.K. Kivilahti
Keyword(s):  
Intermetallic Compound ◽  
Growth Kinetics ◽  
Kinetics Of

Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

2005 ◽  
Vol 486-487 ◽  
pp. 273-276
Author(s):  
Dae Gon Kim ◽  
Hyung Sun Jang ◽  
Young Jig Kim ◽  
Seung Boo Jung
Keyword(s):  
Solid State ◽  
Intermetallic Compound ◽  
Growth Kinetics ◽  
Isothermal Aging ◽  
Flip Chip ◽  
Compound Layer ◽  
Layer Growth ◽  
Intermetallic Compound Layer ◽  
Temperature Range ◽  
Kinetics Of

In the present work, the growth kinetics of intermetallic compound layer formed in Sn-3.5Ag flip chip solder joints by solid-state isothermal aging was examined at temperatures between 80 and 150 °C for 0 to 60 days. The bumping for the flip chip devices was performed using an electroless under bump metallization. The quantitative analyses were performed on the intermetallic compound layer thickness as a function of aging time and aging temperature. The layer growth of the Ni3Sn4 intermetallic compound followed a parabolic law within a given temperature range. As a whole, because the value of the time exponent (n) is approximately equal to 0.5, the layer growth of the intermetallic compound was mainly controlled by diffusion mechanism in the temperature range studied. The apparent activation energy of the Ni3Sn4 intermetallic was 49.63 kJ/mol.

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