Highly (111)-Oriented Nanotwinned Cu for High Fatigue Resistance in Fan-Out Wafer-Level Packaging

2019 ◽  
Author(s):  
Yu-Jin Li ◽  
Chih-Han Theng ◽  
I-Hsin Tseng ◽  
Chih Chen ◽  
Benson Lin ◽  
...  
Keyword(s):  
Fatigue Resistance ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
High Fatigue

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

3D IC/Stacked Device Fault Isolation Using 3D Magnetic Field Imaging

2014 ◽  
Author(s):  
A. Orozco ◽  
N.E. Gagliolo ◽  
C. Rowlett ◽  
E. Wong ◽  
A. Moghe ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Fault Isolation ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Current Location ◽  
Geometrical Information ◽  
Magnetic Field Imaging ◽  
Silicon Vias ◽  
Non Destructive ◽  
Field Imaging

Abstract The need to increase transistor packing density beyond Moore's Law and the need for expanding functionality, realestate management and faster connections has pushed the industry to develop complex 3D package technology which includes System-in-Package (SiP), wafer-level packaging, through-silicon-vias (TSV), stacked-die and flex packages. These stacks of microchips, metal layers and transistors have caused major challenges for existing Fault Isolation (FI) techniques and require novel non-destructive, true 3D Failure Localization techniques. We describe in this paper innovations in Magnetic Field Imaging for FI that allow current 3D mapping and extraction of geometrical information about current location for non-destructive fault isolation at every chip level in a 3D stack.

scholarly journals Effect of mesoscale phase contrast on fatigue-delaying behavior of self-healing hydrogels

2021 ◽  
Vol 7 (16) ◽  
pp. eabe8210
Author(s):  
Xueyu Li ◽  
Kunpeng Cui ◽  
Takayuki Kurokawa ◽  
Ya Nan Ye ◽  
Tao Lin Sun ◽  
...  
Keyword(s):  
Crack Growth ◽  
Fatigue Resistance ◽  
Phase Contrast ◽  
Stress Singularity ◽  
Soft Materials ◽  
Self Healing ◽  
Strong Phase ◽  
Mesoscale Structure ◽  
High Fatigue ◽  
Affine Deformation

We investigate the fatigue resistance of chemically cross-linked polyampholyte hydrogels with a hierarchical structure due to phase separation and find that the details of the structure, as characterized by SAXS, control the mechanisms of crack propagation. When gels exhibit a strong phase contrast and a low cross-linking level, the stress singularity around the crack tip is gradually eliminated with increasing fatigue cycles and this suppresses crack growth, beneficial for high fatigue resistance. On the contrary, the stress concentration persists in weakly phase-separated gels, resulting in low fatigue resistance. A material parameter, λtran, is identified, correlated to the onset of non-affine deformation of the mesophase structure in a hydrogel without crack, which governs the slow-to-fast transition in fatigue crack growth. The detailed role played by the mesoscale structure on fatigue resistance provides design principles for developing self-healing, tough, and fatigue-resistant soft materials.

scholarly journals Utilizing an Adaptive Grey Model for Short-Term Time Series Forecasting: A Case Study of Wafer-Level Packaging

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Che-Jung Chang ◽  
Der-Chiang Li ◽  
Wen-Li Dai ◽  
Chien-Chih Chen
Keyword(s):  
Semiconductor Manufacturing ◽  
Manufacturing System ◽  
Grey System Theory ◽  
Grey Model ◽  
Grey System ◽  
Wafer Level ◽  
Short Term ◽  
Packaging Process ◽  
Wafer Level Packaging

The wafer-level packaging process is an important technology used in semiconductor manufacturing, and how to effectively control this manufacturing system is thus an important issue for packaging firms. One way to aid in this process is to use a forecasting tool. However, the number of observations collected in the early stages of this process is usually too few to use with traditional forecasting techniques, and thus inaccurate results are obtained. One potential solution to this problem is the use of grey system theory, with its feature of small dataset modeling. This study thus uses the AGM(1,1) grey model to solve the problem of forecasting in the pilot run stage of the packaging process. The experimental results show that the grey approach is an appropriate and effective forecasting tool for use with small datasets and that it can be applied to improve the wafer-level packaging process.

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