Laser-Induced Trench Design, Optimisation and Validation for Restricting Capillary Underfill Spread in Advanced Packaging Configurations

2019 ◽  
Author(s):  
Gul Zeb ◽  
David Danovitch ◽  
Eric Turcotte
Keyword(s):  
Design Optimisation ◽  
Advanced Packaging ◽  
Capillary Underfill

Packaging Materials for 2.5/3D Technology

2013 ◽  
Vol 2013 (1) ◽  
pp. 000276-000284 ◽  
Author(s):  
Brian Schmaltz
Keyword(s):  
High Reliability ◽  
Low Cost ◽  
High Yield ◽  
Wafer Level ◽  
Reflow Process ◽  
Thermal Compression ◽  
Conductive Films ◽  
Cu Pillar ◽  
Advanced Packaging ◽  
Capillary Underfill

The age of advanced mobile devices is on the direct horizon, are we ready for it? Less power consumption, faster processing, high reliability, high yield, low cost are words engineers are all too familiar with. 2.5/3D utilizing interposer technology, Thru Silicon Via (TSV), sub-50μm die thickness are a few of the latest techniques engineers use to solve these issues. As technology progresses to smaller process generations, new packaging applications are being demanded. The standard solder reflow process is being pushed by advancements in Cu pillar bumps, thermal compression bonding (TCB) and wafer level / pre-applied materials. This presentation will centralize around the latest advancements in NAMICS Materials for Advanced Packaging Technology; Capillary Underfill (CUF), Pre-Applied Material, Non-Conductive Paste (NCP), Non-Conductive Films (NCF).

Epoxy Underfill Challenges for Copper (Cu) Pillar Solder Bump Packages

2014 ◽  
Vol 2014 (1) ◽  
pp. 000247-000250
Author(s):  
Brian Schmaltz ◽  
Yukinari Abe ◽  
Kazuyuki Kohara
Keyword(s):  
Thermal Cycling ◽  
Solder Ball ◽  
Solder Bump ◽  
High Density ◽  
Lead Free ◽  
Reflow Process ◽  
Stress Concentrations ◽  
Cu Pillar ◽  
Advanced Packaging ◽  
Capillary Underfill

From Eutectic, to Lead Free, to Copper Pillar (Cu) Bumping Technologies. As technology progresses to smaller process generations, new packaging applications are being demanded. The standard solder ball reflow process is being pushed by advancements in copper pillar capped bumps, which in turn allows for high density lead free IO counts at sub 40um bump pitches. Even so, low CTE epoxy materials are still needed in order to dissipate stress concentrations seen during thermal cycling. What challenges await this next technological revision? This presentation will centralize around the latest advancements in epoxy materials for Advanced Packaging Technology; Capillary Underfill (CUF) for narrow pitch Lead Free Copper (Cu) Pillar Solder Bump packages.

Advanced Acoustic Micro Imaging Applications: Deciphering Multiple Acoustic Echoes and Reflections

2004 ◽  
Author(s):  
Andrew J. Komrowski ◽  
Luis A. Curiel ◽  
Daniel J. D. Sullivan ◽  
Quang Nguyen ◽  
Lisa Logan-Willams
Keyword(s):  
Failure Analysis ◽  
Case Studies ◽  
New Technologies ◽  
Electronic Packages ◽  
Advanced Packaging ◽  
Ic Package ◽  
Non Destructive

Abstract The acquisition of reliable Acoustic Micro Images (AMI) are an essential non-destructive step in the Failure Analysis (FA) of electronic packages. Advanced packaging and new IC materials present challenges to the collection of reliable AMI signals. The AMI is complicated due to new technologies that utilize an increasing number of interfaces in ICs and packages. We present two case studies in which it is necessary to decipher the acoustic echoes from the signals generated by the interface of interest in order to acquire trustworthy information about the IC package.

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