Mechanical Characterization of SAC Solder Joints at High Temperature Using Nanoindentation

2017 ◽  
Author(s):  
Sudan Ahmed ◽  
Md Hasnine ◽  
Jeffrey C. Suhling ◽  
Pradeep Lall
Keyword(s):  
High Temperature ◽  
Mechanical Characterization ◽  
Solder Joints ◽  
Sac Solder

scholarly journals Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation

2013 ◽  
Vol 42 (6) ◽  
pp. 1085-1091 ◽  
Author(s):  
S. Lotfian ◽  
J.M. Molina-Aldareguia ◽  
K.E. Yazzie ◽  
J. Llorca ◽  
N. Chawla
Keyword(s):  
High Temperature ◽  
Mechanical Characterization ◽  
Solder Joints ◽  
Lead Free

Experimental set up for the mechanical characterization of plane ITM membrane at high temperature

2015 ◽  
Vol 35 (14) ◽  
pp. 3853-3861 ◽  
Author(s):  
Camille Gazeau ◽  
Jean Gillibert ◽  
Eric Blond ◽  
Pierre-Marie Geffroy ◽  
Nicolas Richet
Keyword(s):  
High Temperature ◽  
Mechanical Characterization ◽  
Set Up

scholarly journals Mechanical Characterization of Fibre Reinforced Polymers Materials at High Temperature

2009 ◽  
Vol 47 (4) ◽  
pp. 1063-1080 ◽  
Author(s):  
E. U. Chowdhury ◽  
R. Eedson ◽  
L. A. Bisby ◽  
M. F. Green ◽  
N. Benichou
Keyword(s):  
High Temperature ◽  
Mechanical Characterization ◽  
Reinforced Polymers

scholarly journals Mechanical characterization of a prototype a-C:Cr,Si and its tribological behavior at high temperature

2016 ◽  
Vol 100 ◽  
pp. 242-254 ◽  
Author(s):  
M.H. Staia ◽  
L. Dubar ◽  
M. Dubar ◽  
E.S. Puchi-Cabrera ◽  
A. Iost ◽  
...  
Keyword(s):  
High Temperature ◽  
Mechanical Characterization ◽  
Tribological Behavior

Microstructural and Mechanical Characterization of Solder Joints Fabricated by Explosively Reacting Nanolayers

2008 ◽  
Author(s):  
Michael Tong ◽  
Jenn-Ming Yang
Keyword(s):  
Initial Temperature ◽  
Mechanical Characterization ◽  
Solder Joints ◽  
Initial Pressure ◽  
Processing Parameters ◽  
Joint Shear Strength ◽  
Lap Shear ◽  
Joint Shear ◽  
Solder Interface

The unique heat-releasing characteristics of explosively reactive nanolayers (RN) are used in this study to produce Si/solder/Si joints. The microstructure of the RN in the reacted state as well as the post-joining foil/solder interface is characterized via XRD, SEM, and TEM, which have never been done. Additionally, RN solder joints are mechanically characterized by single lap shear and nanoindentation to obtain a set of optimized processing parameters, specifically initial pressure applied (Pa) and initial temperature of the system (Ti). A maximum joint shear strength of ∼ 30MPa at Pa = 15MPa and Ti = 75°C. Furthermore, nanoindentation is used to clarify the mechanical behavior of individual layers and interfaces across the joints as a result of thermal aging.

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