Reliability of Cu/NiFe and Cu/Ni Metaconductor Devices for RF Applications

2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2017.182 ◽

2017 ◽

Cited By ~ 1

Author(s):

Timothy Clingenpeel ◽

Yong-Kyu Yoon

Keyword(s):

Rf Applications

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Guidelines for the measurement method of power durability for surface acoustic wave (SAW) and bulk acoustic wave (BAW) devices in radio frequency (RF) applications

10.3403/30366384u ◽

2020 ◽

Keyword(s):

Acoustic Wave ◽

Radio Frequency ◽

Surface Acoustic Wave ◽

Measurement Method ◽

Bulk Acoustic Wave ◽

Rf Applications

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Collaborative Research and Development Delivery Order 0024: Synthesis, Processing, and Evaluation of Polymers for RF Applications

10.21236/ada462792 ◽

2006 ◽

Author(s):

Christy R. Vestal

Keyword(s):

Research And Development ◽

Collaborative Research ◽

Rf Applications

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Erratum: Integrated optical mixer for RF applications

Electronics Letters ◽

10.1049/el:19910249 ◽

1991 ◽

Vol 27 (4) ◽

pp. 392

Author(s):

D. Uttamchandani ◽

H.S. Al-Raweshidy

Keyword(s):

Integrated Optical ◽

Rf Applications ◽

Optical Mixer

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Development and testing of a high voltage direct converter for high power RF applications

IET Pulsed Power Symposium 2006 ◽

10.1049/ic:20060095 ◽

2006 ◽

Cited By ~ 2

Author(s):

D.J. Cook ◽

J.C. Clare ◽

P.W. Wheeler

Keyword(s):

High Voltage ◽

High Power ◽

Rf Applications

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Analysis of field-plate LDMOS devices for RF applications

9th International Seminar on Power Semiconductors (ISPS 2008) ◽

10.1049/ic:20080226 ◽

2008 ◽

Author(s):

I. Cortes ◽

D. Flores ◽

F. Morancho ◽

S. Hidalgo ◽

J. Rebollo

Keyword(s):

Field Plate ◽

Rf Applications

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A Novel LTCC-based 3D Packaging for Ultrawideband RF Applications

2019 International Conference on Microwave and Millimeter Wave Technology (ICMMT) ◽

10.1109/icmmt45702.2019.8992260 ◽

2019 ◽

Author(s):

Jifan Zhang ◽

Dong Dong ◽

Jianghong Liu ◽

Haoxiang Lai

Keyword(s):

3D Packaging ◽

Rf Applications

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Prospects of Two-dimensional Material-based Field-Effect Transistors for Analog/RF Applications

2021 34th International Conference on VLSI Design and 2021 20th International Conference on Embedded Systems (VLSID) ◽

10.1109/vlsid51830.2021.00021 ◽

2021 ◽

Author(s):

Arjun Kumar ◽

Akhilesh Rawat ◽

Brajesh Rawat

Keyword(s):

Field Effect ◽

Field Effect Transistors ◽

Two Dimensional ◽

Rf Applications

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Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications

IEEE Transactions on Very Large Scale Integration (VLSI) Systems ◽

10.1109/tvlsi.2020.3036385 ◽

2020 ◽

pp. 1-10

Author(s):

Chenbing Qu ◽

Zhangming Zhu ◽

Yunfei En ◽

Liwei Wang ◽

Xiaoxian Liu

Keyword(s):

Rf Applications ◽

Area Efficient

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150 mm RF GaN Technology for Commercial RF Applications (Invited)

2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ◽

10.1109/edtm50988.2021.9420945 ◽

2021 ◽

Author(s):

B. Green ◽

K. Moore ◽

S. Klingbeil ◽

C. Ramplev ◽

P. Renaud ◽

...

Keyword(s):

Rf Applications

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Development and power device reliability assessment of resonant pulsed power converters for RF applications

IET Conference on High Power RF Technologies ◽

10.1049/cp.2009.0009 ◽

2009 ◽

Author(s):

F. Carastro ◽

J.C. Clare ◽

M.J. Bland ◽

C.M. Johnson ◽

P.W. Wheeler

Keyword(s):

Power Converters ◽

Reliability Assessment ◽

Pulsed Power ◽

Power Device ◽

Device Reliability ◽

Rf Applications

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