Nondestructive, In Situ Mapping of Die Surface Displacements in Encapsulated IC Chip Packages Using X-Ray Diffraction Imaging Techniques
Keyword(s):
X Ray
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2014 ◽
Vol 47
(6)
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pp. 1882-1888
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2018 ◽
pp. 149-166
2010 ◽
Vol 43
(5)
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pp. 1036-1039
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