In-Situ Warpage Characterization of BGA Packages with Solder Balls Attached During Reflow with 3D Digital Image Correlation (DIC)
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2016 ◽
Vol 18
(9)
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pp. 1651-1660
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2020 ◽
Vol 529
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pp. 119568
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Vol 13
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pp. 943-948
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Vol 46
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pp. 2726-2729
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