Efficient complex broadside coupled trace modeling and estimation of crosstalk impact using statistical BER analysis for high volume, high performance printed circuit board designs

2013 ◽  
Author(s):  
Arun Reddy Chada ◽  
Songping Wu ◽  
Jun Fan ◽  
James L. Drewniak ◽  
Bhyrav Mutnury ◽  
...  
Keyword(s):  
High Performance ◽  
Printed Circuit Board ◽  
High Volume ◽  
Circuit Board ◽  
Printed Circuit ◽  
Ber Analysis

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

scholarly journals HIGH-PERFORMANCE FLEXIBLE FORCE AND TEMPERATURE SENSING ARRAY WITH A ROBUST STRUCTURE

2013 ◽  
Vol 24 ◽  
pp. 1360014
Author(s):  
MIN-SEOK KIM ◽  
HAN-WOOK SONG ◽  
YON-KYU PARK
Keyword(s):  
High Performance ◽  
Sensor Array ◽  
Printed Circuit Board ◽  
High Spatial Resolution ◽  
Tactile Sensor ◽  
Circuit Board ◽  
Micro Fabrication ◽  
Printed Circuit ◽  
Flexible Printed Circuit ◽  
Physical Quantities

We have developed a flexible tactile sensor array capable of sensing physical quantities, e.g. force and temperature with high-performances and high spatial resolution. The fabricated tactile sensor consists of 8 × 8 force measuring array with 1 mm spacing and a thin metal (copper) temperature sensor. The flexible force sensing array consists of sub-millimetre-size bar-shaped semi-conductor strain gage array attached to a thin and flexible printed circuit board covered by stretchable elastomeric material on both sides. This design incorporates benefits of both materials; the semi-conductor's high performance and the polymer's mechanical flexibility and robustness, while overcoming their drawbacks of those two materials. Special fabrication processes, so called “dry-transfer technique” have been used to fabricate the tactile sensor along with standard micro-fabrication processes.

Dielectric and Hot/Wet Properties of Methyl-Silsesquioxane/Cyanate Ester Resin Hybrid Materials

2011 ◽  
Vol 216 ◽  
pp. 630-634
Author(s):  
Zeng Ping Zhang ◽  
Yong Wen ◽  
Hong Zhao Du ◽  
Jian Zhong Pei ◽  
Shuan Fa Chen
Keyword(s):  
Dielectric Constant ◽  
Dielectric Properties ◽  
Dielectric Loss ◽  
High Performance ◽  
Printed Circuit Board ◽  
Cyanate Ester ◽  
Circuit Board ◽  
Printed Circuit ◽  
Cyanate Ester Resin ◽  
Properties Of Materials

Methylsilsesquioxane (Me-SSQ) was incorporated into cyanate ester resin (CE) to obtain organic-inorganic hybrids with better dielectric properties in this study. First, methyltriethoxysilane was hydrolyzed and condensed to synthesize Me-SSQ. Then several Me-SSQ/CE hybrids containing different contents of Me-SSQ were prepared. The effect of Me-SSQ content on the dielectric and hot/wet properties of materials was investigated. Results showed that the Me-SSQ/CE hybrid containing 20wt% of Me-SSQ shows a dielectric constant of 2.78, which is much lower than the pure CE resin. At the same time, the dielectric loss of the Me-SSQ/CE hybrids was slightly increased (tanδ<0.006). It indicates that Me-SSQ/CE hybrid is a promising matrix materials for high-performance printed circuit board (PCB).

High-Performance Printed Circuit Board Materials Based on Benzoxazine and Epoxy Blend System

2018 ◽  
Vol 26 (4) ◽  
pp. 388-393 ◽  
Author(s):  
Seon Ho Lee ◽  
Ki Seok Kim ◽  
Ji Hye Shim ◽  
Cheol-Hee Ahn
Keyword(s):  
High Performance ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit
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