Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis
2015 ◽
Vol 74
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pp. 87-93
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2012 ◽
Vol 212
(1)
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pp. 276-285
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2014 ◽
Vol 38
(8)
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pp. 857-862
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1997 ◽
Vol 31
(1)
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pp. 37-51
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2010 ◽
Vol 452-453
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pp. 389-392
2012 ◽
Vol 48
(2)
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pp. 1031-1034
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