scholarly journals Temperature-dependent thermal stress determination for through-silicon-vias (TSVs) by combining bending beam technique with finite element analysis

Author(s):  
Kuan H. Lu ◽  
Suk-Kyu Ryu ◽  
Qiu Zhao ◽  
Klaus Hummler ◽  
Jay Im ◽  
...  
Author(s):  
Jaan Taagepera ◽  
Marty Clift ◽  
D. Mike DeHart ◽  
Keneth Marden

Three vessel modifications requiring heat treatment were analyzed prior to and during a planned turnaround at a refinery. One was a thick nozzle that required weld build up. This nozzle had been in hydrogen service and required bake-out to reduce the potential for cracking during the weld build up. Finite element analysis was used to study the thermal stresses involved in the bake-out. Another heat treatment studied was a PWHT of a nozzle replacement. The heat treatment band and temperature were varied with location in order to minimize cost and reduction in remaining strength of the vessel. Again, FEA was used to provide insight into the thermal stress profiles during heat treatment. The fmal heat treatment study was for inserting a new nozzle in a 1-1/4Cr-1/2Mo reactor. While this material would ordinarily require PWHT, the alteration was proposed to be installed without PWHT. Though accepted by the Jurisdiction, this nozzle installation was ultimately cancelled.


2019 ◽  
Vol 7 (1) ◽  
pp. 1977-1986 ◽  
Author(s):  
Chih-Kuang Lin ◽  
Tsung-Ting Chen ◽  
An-Shin Chen ◽  
Yau-Pin Chyou ◽  
Lieh-Kwang Chiang

2010 ◽  
Vol 452-453 ◽  
pp. 389-392
Author(s):  
Fumitaka Motomura ◽  
Akihide Saimoto

An optimal condition of thermal stress cleaving was investigated by assuming the element-by-element temperature rise situation using finite element method. The obtained thermal stress cleaving condition is found to be optimal for the symmetrical cleaving of a rectangular plate.


2012 ◽  
Vol 48 (2) ◽  
pp. 1031-1034 ◽  
Author(s):  
P. Zhou ◽  
D. Lin ◽  
Y. Xiao ◽  
N. Lambert ◽  
M. A. Rahman

Sign in / Sign up

Export Citation Format

Share Document