Improving Mold Compound Adhesion to Ni/Pd/Au Pre-plated Lead Frames

56th Electronic Components and Technology Conference 2006 ◽

10.1109/ectc.2006.1645845 ◽

2006 ◽

Cited By ~ 3

Author(s):

G. Kim ◽

J. Hurley ◽

A. Dhoble ◽

S. Avdic

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