Experimental testing and computational stress analysis of printed circuit board for the failure prediction of passive components under the depaneling load condition

2005 ◽  
Author(s):  
D. Lau ◽  
M. Tsang ◽  
S.W.R. Lee ◽  
J. Lo ◽  
Lifong Fu ◽  
...  
Keyword(s):  
Stress Analysis ◽  
Printed Circuit Board ◽  
Experimental Testing ◽  
Load Condition ◽  
Failure Prediction ◽  
Circuit Board ◽  
Passive Components ◽  
Printed Circuit

Correlation Between the Strain on the Printed Circuit Board and the Stress in Chips for the Failure Prediction of Passive Components

2005 ◽  
Author(s):  
Dennis Lau ◽  
S. W. Ricky Lee
Keyword(s):  
Stress Analysis ◽  
Printed Circuit Boards ◽  
Load Condition ◽  
Failure Prediction ◽  
Circuit Board ◽  
System Level ◽  
Design Rule ◽  
Passive Components ◽  
Printed Circuit ◽  
Microelectronic Devices

Due to the demand for miniaturization of microelectronic devices, the density of packaging has become higher and higher. Also, the sizes of components have become smaller and smaller. In addition to advanced active components such as chip scale packages (CSPs) and flip chips (FCs), mini sized passive components such as chip capacitors and resistors are also important elements for high density packaging. It is quite common to see dozens up to hundreds of passive components on printed circuit boards (PCBs). Both active and passive components contribute to the function (and also malfunction) of electronic systems. However, the reliability issues of passive components are often overlooked because they are relatively small in size and cheap in cost. In view of the fact that “small components could lead to big problems”, the present study is conducted to evaluate the threat to passive components assembled on PCBs under a specific type of mechanical loading. Because of the nature of mass production, microelectronic devices are always manufactured in a batch mode. It is quite often that several PCBs are linked together during the surface mount assembly process. Even if the PCB is a stand-alone unit, extra peripheral frames or tie bars are needed for tooling and fixture. After the board level assembly, a depaneling process is usually required to singulate individual PCBs or to remove the tooling frames for the system level assembly. Some depaneling processes may be automated with precision control. However, it is not unusual for operators in the factory to perform manual depaneling. During this process, the PCB is subjected to mechanical bending and the curvature of the bent PCB may be big enough to damage small passive components. The present study is intended to establish a model for the failure prediction of passive components under depaneling load condition. Computational stress analysis is performed with a 3D finite element model. The emphasis is placed on finding the correlation between the bending strain on the PCB (which is an index of the local curvature of the bent PCB) and the bending stress in the passive components (which is the reason to crack capacitors/resistors). It is observed that such a relationship can be established. With this model, the cracking of passive components may be predicted under the depaneling load condition. The understanding of this potential threat can be turned into a design rule to avoid mounting passive components in the “high risk” area on the PCB. As a result, the objective of “design for reliability” (DFR) can be achieved. The details of the aforementioned model and the results of stress analysis will be presented in this paper.

Magnetic Emission Mapping for Passive Integrated Components Characterisation

2003 ◽  
Author(s):  
O. Crépel ◽  
Y. Bouttement ◽  
P. Descamps ◽  
C. Goupil ◽  
P. Perdu ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Mobile Phone ◽  
Printed Circuit Board ◽  
Magnetic Sensors ◽  
Circuit Board ◽  
Magnetic Disturbance ◽  
Passive Components ◽  
Printed Circuit ◽  
Integrated Inductor ◽  
The Magnetic Field

Abstract We developed a system and a method to characterize the magnetic field induced by circuit board and electronic component, especially integrated inductor, with magnetic sensors. The different magnetic sensors are presented and several applications using this method are discussed. Particularly, in several semiconductor applications (e.g. Mobile phone), active dies are integrated with passive components. To minimize magnetic disturbance, arbitrary margin distances are used. We present a system to characterize precisely the magnetic emission to insure that the margin is sufficient and to reduce the size of the printed circuit board.

Flexible Electronics Fabrication for Missile Wiring Interconnects

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 001096-001114
Author(s):  
Michael R. Whitley ◽  
Tracy D. Hudson
Keyword(s):  
Unmanned Aerial Vehicles ◽  
Flexible Electronics ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Polyimide Films ◽  
Passive Components ◽  
Printed Circuit ◽  
Data Formats ◽  
Aerial Vehicles ◽  
Ink Jet

The increased usage of unmanned aerial vehicles has driven the desire for smaller and lighter missile bodies. The wiring harnesses required to connect the missile subsystems constitute a significant portion of the missile weight and cost. We have been exploring the development of flexible electronics substrates manufactured using ink jet technology on polyimide films. This technology has an advantage over traditional flex circuit manufacturing because in addition to creating traditional wiring patterns the ink jet technology enables the creation of passive components such as resistors and capacitors. The Dimatix DMP-2831 ink jet system uses individually controllable piezoelectric driven MEMS nozzles to precisely deposit nanoparticle inks. These inks are then annealed to form wiring patterns. We will present the process for converting traditional printed circuit board data formats to inkjet printable data, the process for depositing the ink, annealing and testing.

A Novel Discrete Passives Integration on Organic Substrate

2005 ◽  
Author(s):  
Vasudivan Sunappan ◽  
Chee Wai Lu ◽  
Lai Lai Wai ◽  
Wei Fan ◽  
Boon Keng Lok
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Organic Substrate ◽  
Temperature Cycling ◽  
Circuit Board ◽  
Electrical Performance ◽  
Core Material ◽  
Bottom Surface ◽  
Passive Components ◽  
Printed Circuit

A novel process has been developed to embed discrete (surface mountable) passive components like capacitors, resistors and inductors using printed circuit board fabrication technology. The process comprises of mounting passive components on top surface of a core PCB (printed circuit board) material using surface mount technology. The passive components mounting were designed in multiple clusters within the PCB. Dielectric sheets are sandwiched between top surface of core PCB and second PCB material for lamination process. A direct interconnection of the passive components to one or more integrated circuits (IC) is further accomplished by mounting the ICs on the bottom surface of the core material in an area directly under the passive components. The close proximity of the embedded passive components such as capacitors to an IC improved electrical performance by providing impedance reduction and resonance suppression at high frequency range. The reliability of solder joints was evaluatedd by temperature cycling test.

scholarly journals Modeling the Impact of Embedding Passives on Manufacturing System Performance

2002 ◽  
Author(s):  
Mandar M. Chincholkar ◽  
Jeffrey W. Herrmann
Keyword(s):  
Real Estate ◽  
System Performance ◽  
Manufacturing System ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Passive Components ◽  
Electronic Products ◽  
Printed Circuit ◽  
Processing Times ◽  
The Impact

With the miniaturization of electronic products, reducing the size of the printed circuit board that forms the backbone of the product is paramount. Embedding passive components, which otherwise occupy valuable “real estate” atop the printed circuit board, into the printed circuit board substrate itself is one way of achieving this objective. This first part of this paper examines the techniques and advantages of embedding passives. Embedding passives also affects manufacturing system performance, due to a change in the processing sequence and changes to the processing times at resources. The latter portion of this paper describes a design for production tool for understanding the impact of embedding passives on the performance of a manufacturing system.

scholarly journals Influence of powerful electromagnetic pulses on the operation of typical integrated microcontrollers.

2020 ◽  
Vol 2020 (11) ◽  
Author(s):  
V.A. Vdovin ◽  
◽  
A.A. Geraskin ◽  
P.A. Gorbokonenko ◽  
S.A. Sapetskiy ◽  
...  
Keyword(s):  
Electromagnetic Pulse ◽  
Printed Circuit Board ◽  
Supply Voltage ◽  
Circuit Board ◽  
Electromagnetic Pulses ◽  
Passive Components ◽  
Electric Pulses ◽  
Printed Circuit ◽  
Logic Operations ◽  
Electrical Impulses

The effects arising in an integrated microchip (IC) of a microcontroller (MC) performing test logic operations under the action of powerful electrical impulses are investigated. The IC MC STM8S003 was chosen as a typical microcontroller. The exposure was carried out by electric pulses with an electric field strength of up to 20 kV/cm and a duration of 6 ns. It is shown that impulse influences can lead to logical failures when performing IC MC logical operations, the effectiveness of the influence depends not only on the parameters of the electromagnetic pulse, but also on the specific operation performed during which it occurred. The repetition rate of electromagnetic pulses up to 1 kHz does not significantly affect the type of failures of the IC MC. The supply voltage of the IC MC affects its stability; to create a failure, an increase in the amplitude of the electromagnetic pulse is required with an increase in the supply voltage. Passive components of a printed circuit board are more susceptible to electromagnetic influences than IC MC.

Sign in / Sign up

Export Citation Format

Share Document