Solid-state microchip laser bonding by a low temperature epoxy-free and flux-less process

2005 ◽  
Author(s):  
C. Kopp ◽  
K. Gilbert
Keyword(s):  
Solid State ◽  
Low Temperature ◽  
Microchip Laser ◽  
Laser Bonding

scholarly journals Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 335
Author(s):  
Gyuwon Jeong ◽  
Dong-Yurl Yu ◽  
Seongju Baek ◽  
Junghwan Bang ◽  
Tae-Ik Lee ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Low Temperature ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Interfacial Reactions ◽  
Circuit Boards ◽  
Ag Nps ◽  
Laser Bonding ◽  
Laser Soldering ◽  
Low Temperature Bonding

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.

A single-phase all-solid-state lithium battery based on Li1.5Cr0.5Ti1.5(PO4)3 for high rate capability and low temperature operation

2018 ◽  
Vol 54 (25) ◽  
pp. 3178-3181 ◽  
Author(s):  
Atsushi Inoishi ◽  
Akira Nishio ◽  
Yuto Yoshioka ◽  
Ayuko Kitajou ◽  
Shigeto Okada
Keyword(s):  
Solid State ◽  
Low Temperature ◽  
Lithium Battery ◽  
Single Phase ◽  
Rate Capability ◽  
High Rate ◽  
High Rate Capability ◽  
Single Material

We report a battery made from a single material using Li1.5Cr0.5Ti1.5(PO4)3 as the anode, cathode and electrolyte.

Kinetic Research of Boron Oxide Reducing Reaction at Low Temperature

2012 ◽  
Vol 512-515 ◽  
pp. 2372-2375 ◽  
Author(s):  
Ding Guo Zhao ◽  
Shu Huan Wang ◽  
Xiao Jie Cui ◽  
Jian Long Guo
Keyword(s):  
Solid State ◽  
Low Temperature ◽  
Boron Oxide ◽  
Reduction Rate ◽  
Order Reaction ◽  
Boron Steel ◽  
Second Order Reaction ◽  
Solid Reaction ◽  
Carbon Tube ◽  
Direct Alloying

The reducing process of boron-containing slag at low temperature is an important stage of the direct alloying for smelting boron steel. At low temperature boron slag generates mainly solid - solid reaction in the sintering period. The experiments were done on the carbon tube furnace in laboratory, and the effect of slag reaction in different times at 1200°C was researched. The samples were analyzed by XRD after the reaction. The experimental results shown that the reduction rate increased by increasing reducing time. The chemical reducing reaction of boron oxide by ferrosilicon is second-order reaction at solid state.

Facile low temperature solid state synthesis of iodoapatite by high-energy ball milling

RSC Advances ◽  
2014 ◽  
Vol 4 (73) ◽  
pp. 38718-38725 ◽  
Author(s):  
Fengyuan Lu ◽  
Tiankai Yao ◽  
Jinling Xu ◽  
Jingxian Wang ◽  
Spencer Scott ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Solid State ◽  
Low Temperature ◽  
Ball Milling ◽  
Thermal Annealing ◽  
Amorphous Matrix ◽  
High Energy ◽  
High Energy Ball Milling ◽  
Solid State Synthesis ◽  
Energy Ball

High energy ball milled iodoapatite in the form of an amorphous matrix embedded with nanocrystals can be readily crystallized by subsequent low temperature thermal annealing, which greatly improves the thermal stability and iodine confinement.

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