Impact of material properties and assembly geometry on bond-line stress when bonding PCBs to heat sinks with an isotropic conductive adhesive. Part II
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2006 ◽
Vol 40
(21)
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pp. 1961-1969
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2008 ◽
Vol 37
(4)
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pp. 462-468
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2007 ◽
Vol 36
(6)
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pp. 669-675
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2018 ◽
Vol 95
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pp. 204-217
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2018 ◽
Vol 8
(3)
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pp. 12-22
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