Low cycle fatigue analysis of microelectronics solder joints incorporating damage and size effects using a thermodynamics based rate dependent constitutive model
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2005 ◽
Vol 42
(13)
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pp. 3744-3772
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2010 ◽
Vol 37
(3/4)
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pp. 312
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2003 ◽
Vol 16
(04)
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pp. 356
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2013 ◽
Vol 43
(2)
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pp. 586-593
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2014 ◽
Vol 5
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pp. 2392-2401
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