Proceedings 55th Electronic Components & Technology Conference

2005 ◽  
Keyword(s):  
Electronic Components

Finite Element Analysis applied on the Cooling of Electronic Components

2018 ◽  
Author(s):  
Luís Henrique Carnevale da Cunha ◽  
Gustavo Rabello dos Anjos ◽  
Norberto Mangiavacchi
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Electronic Components ◽  
Element Analysis

BERYLCO NICKEL ALLOY 440

Alloy Digest ◽  
1975 ◽  
Vol 24 (9) ◽  
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Nickel Alloy ◽  
High Strength ◽  
Heat Treating ◽  
Electronic Components ◽  
High Temperature Mechanical Properties ◽  
Temperature Performance ◽  
Solution Treated ◽  
Complex Shapes

Abstract BERYLCO NICKEL ALLOY 440 is an age-hardenable nickel-beryllium-titanium alloy that offers high strength, excellent spring properties outstanding formability, good high-temperature mechanical properties, and resistance to corrosion and fatigue. Complex shapes can be produced in the solution-treated (soft) condition and then aged to a minimum tensile strength of 215,500 psi. It is used for mechanical and electrical/electronic components in the temperature range -320 to 800 F. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as fracture toughness. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Ni-94. Producer or source: Kawecki Berylco Industries Inc.. Originally published September 1964, revised September 1975.

HPM 233

Alloy Digest ◽  
2006 ◽  
Vol 55 (4) ◽  
Keyword(s):  
Corrosion Resistance ◽  
Physical Properties ◽  
Tensile Properties ◽  
Heat Treating ◽  
Low Carbon ◽  
Electronic Components

Abstract HPM 233 is a wrought nickel with low carbon. The alloy is used in electrical and electronic components. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Ni-635. Producer or source: Hamilton Precision Metals.

PCB Related Field Failures with ImAg Surface Finishes

2007 ◽  
Author(s):  
Anil Kurella ◽  
Aravind Munukutla ◽  
J.S. Lewis
Keyword(s):  
Emerging Markets ◽  
Galvanic Corrosion ◽  
Electrochemical Migration ◽  
Copper Sulphide ◽  
Electronic Components ◽  
Related Field ◽  
Surface Finishes ◽  
Immersion Silver ◽  
Manufacturing Environments

Abstract PCB surface finishes like Immersion silver (ImAg) are commonly used in Pb-free manufacturing environments following RoHS legislation. With this transition, however the numbers of field failures associated with electrochemical migration, copper sulphide corrosion, via barrel galvanic corrosion are on a steady rise. More often than not ImAg surfaces seem to assist these failing signatures. As computers penetrate into emerging markets with humid and industrialized environments there is a greater concern on the reliability and functionality of these electronic components.

Investigation of Die Tilting of Packages with Single and Multi-chips

2018 ◽  
Author(s):  
Lo Chea Wee ◽  
Tan Sze Yee ◽  
Gan Sue Yin ◽  
Goh Cin Sheng
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Electron Beam ◽  
Optical Microscopy ◽  
Device Performance ◽  
Electronic Components ◽  
Area Of Interest ◽  
On Chip ◽  
Scanning Electron

Abstract Advanced package technology often includes multi-chips in one package to accommodate the technology demand on size & functionality. Die tilting leads to poor device performance for all kinds of multi-chip packages such as chip by chip (CbC), chip on chip (CoC), and the package with both CbC and CoC. Traditional die tilting measured by optical microscopy and scanning electron microscopy has capability issue due to wave or electron beam blocking at area of interest by electronic components nearby. In this paper, the feasibility of using profilemeter to investigate die tilting in single and multi-chips is demonstrated. Our results validate that the profilemeter is the most profound metrology for die tilting analysis especially on multi-chip packages, and can achieve an accuracy of <2μm comparable to SEM.

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