Power delivery system performance optimization of a printed circuit board with multiple microprocessors

2004 ◽  
Author(s):  
O.P. Mandhana ◽  
Jin Zhao
Keyword(s):  
Delivery System ◽  
Performance Optimization ◽  
System Performance ◽  
Printed Circuit Board ◽  
Power Delivery ◽  
Circuit Board ◽  
Printed Circuit

scholarly journals Modeling the Impact of Embedding Passives on Manufacturing System Performance

2002 ◽  
Author(s):  
Mandar M. Chincholkar ◽  
Jeffrey W. Herrmann
Keyword(s):  
Real Estate ◽  
System Performance ◽  
Manufacturing System ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Passive Components ◽  
Electronic Products ◽  
Printed Circuit ◽  
Processing Times ◽  
The Impact

With the miniaturization of electronic products, reducing the size of the printed circuit board that forms the backbone of the product is paramount. Embedding passive components, which otherwise occupy valuable “real estate” atop the printed circuit board, into the printed circuit board substrate itself is one way of achieving this objective. This first part of this paper examines the techniques and advantages of embedding passives. Embedding passives also affects manufacturing system performance, due to a change in the processing sequence and changes to the processing times at resources. The latter portion of this paper describes a design for production tool for understanding the impact of embedding passives on the performance of a manufacturing system.

An Innovative Printed Circuit Board Power Delivery Scheme

2011 ◽  
Vol 2011 (1) ◽  
pp. 000069-000072
Author(s):  
Zhenggang Cheng ◽  
Peter Gunadisastra ◽  
Amit Agrawal
Keyword(s):  
Printed Circuit Board ◽  
Cost Effective ◽  
Power Delivery ◽  
Circuit Board ◽  
System Level ◽  
Voltage Regulator ◽  
Printed Circuit ◽  
Noise Simulation ◽  
Power Noise ◽  
Shared Power

In this paper, an innovative board power delivery scheme with two separate power planes merging at VRM (voltage regulator modular) has been studied. The two separate power planes provide power for two different core power rails with the same value. Compared to traditional board power delivery schemes such as two separate power planes with two VRMs or one shared power plane with one VRM, the new power delivery scheme has been found to be cost effective and have good performance for our application by using system level transient power noise simulation and analysis.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

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