Interfacial fracture toughness test methodology for flip chip underfill encapsulant

Author(s):  
H.L.J. Pang ◽  
X.R. Zhang ◽  
C.H. Lim ◽  
X.Q. Shi ◽  
Z.P. Wang
1998 ◽  
Vol 120 (2) ◽  
pp. 150-155 ◽  
Author(s):  
X. Yan ◽  
R. K. Agarwal

Two test specimens are developed to measure interfacial fracture toughness in flip-chip assemblies. The specimens consist of three layers: silicon chip, underfill, and circuit board. Two symmetric edge cracks are embedded along the interface, either between the chip and the underfill or between the underfill and the circuit board. The specimens are subjected to four-point-bend loading and critical loads are obtained. Analytical solutions for energy release rate have been derived for these two specimens and used to obtain the toughness from the measured critical loads. These specimens have been used to evaluate material combinations of chip passivation, underfill and solder mask for desired interfacial strength.


2007 ◽  
Vol 73 (735) ◽  
pp. 1266-1272 ◽  
Author(s):  
Yoshiaki NOMURA ◽  
Masaki NAGAI ◽  
Toru IKEDA ◽  
Noriyuki MIYAZAKI

2010 ◽  
Vol 146-147 ◽  
pp. 1524-1528 ◽  
Author(s):  
Xue Zhi Wang ◽  
Zong Chao Xu ◽  
Zhong Bi ◽  
Hao Wang

The wedge splitting test specimens with three series of different relative crack length were used to study the influences of relative crack length on the fracture toughness of common concrete. The suitable formulation for fracture toughness of concrete with different relative crack length was gotten on comparing between fracture toughness test results and computation results of the model developed from Hu formula.


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