Effect of strain rate on solder joint failure under mechanical load

2003 ◽  
Author(s):  
P. Geng ◽  
P. Chen ◽  
Yun Ling
Keyword(s):  
Solder Joint ◽  
Strain Rate ◽  
Mechanical Load ◽  
Joint Failure

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

2012 ◽  
Vol 134 (4) ◽  
Author(s):  
D. N. Borza ◽  
I. T. Nistea
Keyword(s):  
Solder Joint ◽  
Fundamental Frequency ◽  
Printed Circuit Board ◽  
Speckle Interferometry ◽  
Circuit Board ◽  
Joint Failure ◽  
Printed Circuit ◽  
Out Of Plane ◽  
Fringe Patterns ◽  
Board Level

Reliability of electronic assemblies at board level and solder joint integrity depend upon the stress applied to the assembly. The stress is often of thermomechanical or of vibrational nature. In both cases, the behavior of the assembly is strongly influenced by the mechanical boundary conditions created by the printed circuit board (PCB) to casing fasteners. In many previously published papers, the conditions imposed to the fasteners are mostly aiming at an increase of the fundamental frequency and a decrease of static or dynamic displacement values characterizing the deformation. These conditions aim at reducing the fatigue in different parts of these assemblies. In the photomechanics laboratory of INSA Rouen, the origins of solder joint failure have been investigated by means of full-field measurements of the flexure deformation induced by vibrations or by forced thermal convection. The measurements were done both at a global level for the whole printed circuit board assembly (PCBA) and at a local level at the solder joints where failure was reported. The experimental technique used was phase-stepped laser speckle interferometry. This technique has a submicrometer sensitivity with respect to out-of-plane deformations induced by bending and its use is completely nonintrusive. Some of the results were comforted by comparison with a numerical finite elements model. The experimental results are presented either as time-average holographic fringe patterns, as in the case of vibrations, or as wrapped phase patterns, as in the case of deformation under thermomechanical stress. Both types of fringe patterns may be processed so as to obtain the explicit out-of-plane static deformation (or vibration amplitude) maps. Experimental results show that the direct cause of solder joint failure may be a high local PCB curvature produced by a supplementary fastening screw intended to reduce displacements and increase fundamental frequency. The curvature is directly responsible for tensile stress appearing in the leads of a large quad flat pack (QFP) component and for shear in the corresponding solder joints. The general principle of increasing the fundamental frequency and decreasing the static or dynamic displacement values has to be checked against the consequences on the PCB curvature near large electronic devices having high stiffness.

Investigation on the failure criterion of reliability testing for Pb-free BGA packages

2010 ◽  
Vol 2010 (1) ◽  
pp. 000105-000109
Author(s):  
Weidong Xie ◽  
Tae-Kyu Lee ◽  
Kuo-Chuan Liu ◽  
Jie Xue
Keyword(s):  
Solder Joint ◽  
Failure Criterion ◽  
Reliability Testing ◽  
Threshold Values ◽  
Joint Failure ◽  
Failure Distribution ◽  
Free Solder ◽  
The Impact ◽  
Different Sources ◽  
Over Time

Daisy-chained test vehicles are commonly used in board level reliability testing. By continuously monitoring the in-situ daisy chain resistance change over time, a failure could be captured during cycling and eventually the failure data could be used to establish the solder joints failure distribution under different testing conditions. One of the most debatable matters is that when should one to determine a failure to occur. Per IPC 9701A [1] a failure is defined as 10 1000-ohm events in 1 micro-second duration for event detector or 20% increase over the baseline resistance for data logger. Other threshold values such as 100, 300, or 500 ohms are also commonly used by packaging reliability community. Such a wide range of failure threshold values may introduce significant delta in terms of cycle numbers for Pb-free solder joints if different criteria would be used as reported by Henshall, etc [2]. Therefore a systematic study of the impact of using such diversified resistance values on the final failure distribution is necessary and important such that no big difference among reliability results from different sources. The purpose of this study is to investigate the impact of different failure thresholds on Pb-free solder joint failure distribution for most commonly used packages. The test vehicle, designed on an 8″×15″ double-sided printed circuit board (PCB) with multiple test sites, was populated on both sides with daisy-chained components. To reflect the real situation, the components were selected to include different package types (FCBGA, PBGA, CSP, QFN, etc), different pitches (0.4–1.0 mm), and different package size (6–50mm). The assembled test vehicles then went through 0C–100C thermal cycling, the cycle numbers corresponding to different resistance thresholds were recorded and compared. The test results showed that the failure threshold has significant impact on Pb-free solder joint failure distribution, thus it is important to unify the failure criterion such that the reliability results from different sources could be compared side by side. For some packages especially small wire-bond packages that have relatively low baseline resistance, the 20% failure criterion may be too sensitive to the resistivity changes caused not by solder joint failure but other events such as connection cable resistivity change over time or temperature.

Micro Impact Testing of Lead Free Solder Joints

2008 ◽  
Vol 32 ◽  
pp. 99-102
Author(s):  
Ranjan Rajoo ◽  
Erich H. Kisi ◽  
D.J. O'Connor
Keyword(s):  
Solder Joint ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Intermetallic Layer ◽  
Displacement Transducer ◽  
Impact Testing ◽  
Lead Free ◽  
Linear Variable Displacement Transducer ◽  
Free Solder

This paper presents data obtained from a newly-developed instrument to test the quality of solder interconnections at high strain rate – the ‘micro-impactor’. This shear test of the interconnection at high strain rate mimics the stress experienced by the solder joint when undergoing shock due to drop-impact. Instrumented with a load cell and linear variable displacement transducer (LVDT), it also has the ability to provide dynamic impact force and displacement data. Earlier concepts to characterise the solder joint at high strain rates such as the miniature pendulum impact tester [1] lacked this capability. This micro-impactor was used to study the effect of increasing silver (Ag) and copper (Cu) concentration in solder alloys on the shear strength of the solder joint. The performance of these lead-free alloys was also compared to that of the well-established leaded solder. It was found that increasing the silver content increases the yield strength of the solder, causing the failure to occur at the brittle intermetallic layer instead of in the bulk of the solder.

A Study on the Effects of Strain Rates on Characteristics of Brain Tissue

2017 ◽  
Author(s):  
Mohammad Hosseini Farid ◽  
Ashkan Eslaminejad ◽  
Mariusz Ziejewski ◽  
Ghodrat Karami
Keyword(s):  
Strain Rate ◽  
Brain Tissue ◽  
Mechanical Load ◽  
Experimental Studies ◽  
High Rate ◽  
Dynamic Strain ◽  
Strain Rates ◽  
Compression Tests ◽  
Static Strain ◽  
The Brain

Traumatic brain injury (TBI) often happens when the brain tissue undergoes a high rate mechanical load. Although numerous research works have been carried out to study the mechanical characterization of brain matter under quasi-static (strain rate ≤ 100 S−1) loading but a limited amount of experimental studies are available for brain tissue behavior under dynamic strain rates (strain rate ≥ 100 S−1). In this paper, the results of a study on mechanical properties of ovine brain tissue under unconfined compression tests are to be presented. The samples were compressed under uniaxial strain rates of 0.0667, 3.33, 6.667, 33.33, 66.667 and 200 S−1. The brain tissue presents a stiffer response with increasing strain rate, showing a time-dependent behavior. So the hyperelastic-only models are not adequate to exhibit the brain viscoelasticity. Therefore, two hyper-viscoelastic constitutive equations based on power function model and Mooney-Rivlin energy function are applied to the results with quasi-static strain rate (≤ 100 S−1). Good agreement of experimental and theoretical has been achieved for results of the low strain rates. It is concluded that the obtained material parameters from quasi-static tests are not appropriate enough to fit the result with the high strain rate of 200 S−1. The study will further provide new insight into a better understanding of the rate-dependency behavior of the brain tissue under dynamic conditions. This is essential in the development of constitutive material characteristics for an efficient human brain finite element models to predict TBI under impact condition or high motion.

Solder joint failure modes in crystalline Si PV modules operated in Tsukuba, Japan for 10 years

2014 ◽  
Author(s):  
Uichi Itoh ◽  
Tetsuro Nishimura ◽  
Takuro Fukami ◽  
Kenji Takamura ◽  
Akira Kita ◽  
...  
Keyword(s):  
Solder Joint ◽  
Failure Modes ◽  
Joint Failure ◽  
Pv Modules
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